Effect of Laser Loop on Surface Morphology of Copper Substrate and Wettability of Solder Joint

Abstract

The effect of different laser loop parameter on the geometry of micro-groove pattern on copper substrate and its effect on the wettability was investigated. The micro-grooves pattern was fabricated on the copper surface through laser surface texturing process. 3D measuring laser microscope and contact angle measurement test was conducted to measure the geometry of the micro-grooves pattern and wettability of the solder joint respectively. The results showed that the improvement in laser loop parameter increased the depth of the micro-grooves due to the more exposed time which allows more material ablation. It also showed that the contact angle of textured substrate is smaller than the untextured substrate which results in better wettability.

Enhancement of laser heating process by laser surface modification on Titanium alloy

“…For instance, the chemical and ECM etching processes are accompanied by chemical work, which adversely affects the environment [7]. Besides, in terms of processing time, LSM is considered as extremely fast process which allows short processing times [8,9]. For instance, LSM process consumes a much shorter time than chemical etching since the latter required more procedures [10].…”