The whisker phenomenon has caused the reliability issues which induce short circuit in the electronic manufacturing industries. The research is conducted to study on the formation of pure tin whisker under the control of stress and temperature with the application of mechanical indentation and the formation of whisker can be classified into distinct shape accordingly. The specified ranges of stress and surrounding temperature are set up accordingly to promote the whisker mechanism of pure tin whisker. The pure tin whisker formed is examined in term of morphology characterization via Optical Microscope and Scanning Electron Microscope to analyze on the effect of stress and temperature on the growth morphology of pure tin whisker. This report outlines the research in progress on the development of the pure tin whisker formation.
This research has investigated the advantages of Sn-0.7Cu composite solder compared to conventional Sn-0.7Cu solder. The method used for fabricating the composite solder is a powder metallurgy (PM) technique. SiC and Al particles were added to Sn-0.7Cu powder during the mixing process. The Sn-0.7Cu solder composite that reinforced with 0.25 wt% of SiC and 0.5 wt% of Al, were successfully synthesized via PM technique. The result showed that the addition of SiC and Al were improving the mechanical properties and thermal stability of the solder as well as reduces the material cost.
Composite solder has gained researcher’s attention due to its promising improvement in physical and mechanical properties for lead-free solder. To improve the properties of Sn-3.0Ag-0.5Cu (SAC) with the promising lead-free candidate, addition of silicon carbide (SiC) as a reinforcement was used in this study. This study was carried out to identify the effect of SiC particle on microstructure evolution and physical properties of SAC based solder alloys. SAC-SiC composite solder was synthesized by powder metallurgy method (PM), which consists of several processes such as mechanical blending, compaction and sintering. Three different weight percentages of SiC particles; 0.00, 0.50, and 1.00 were mechanically blended with SAC lead-free solder. The results show that the additional of particle SiC was able to refine the microstructure and reduced the size of β-Sn.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.