No abstract

Beta phase Gallium Oxide (BGO) is an emerging ultra-wide bandgap semiconductor with disruptive potential for ultra-low power loss, high-efficiency power applications. The critical field strength is the key enabling material parameter of BGO which allows sub-micrometer lateral transistor geometry. This property combined with ion-implantation technology and large area native substrates result in exceptionally low conduction power losses, faster power switching frequency and even radio frequency power. We present a review of BGO epitaxial materials and lateral field-effect transistors developments, highlight early achievements and discuss engineering solutions with power switching and radio frequency applications in mind.

We report the first demonstration of self-aligned gate (SAG) β-Ga2O3 metal-oxide-semiconductor field-effect transistors (MOSFETs) as a path toward eliminating source access resistance for low-loss power applications. The SAG process is implemented with a subtractively defined and etched refractory metal, such as Tungsten, combined with ion-implantation. We report experimental and modeled DC performance of a representative SAG device that achieved a maximum transconductance of 35 mS mm−1 and an on-resistance of ∼30 Ω mm with a 2.5 μm gate length. These results highlight the advantage of implant technology for SAG β-Ga2O3 MOSFETs enabling future power switching and RF devices with low parasitic resistance.

We report on vertical β-Ga2O3 power diodes with oxidized-metal Schottky contact (PtOx) and high permittivity (high-κ) dielectric (ZrO2) field plate to improve reverse blocking at both Schottky contact surfaces and edges. The PtOx diodes showed excellent forward transport with near unity ideality factor and similar minimum specific on-resistance as Pt. Moreover, the PtOx contacts facilitated higher breakdown voltage and lower leakage current due to their higher Schottky barrier height (SBH) by more than 0.5 eV compared to that of Pt. Most importantly, the reduced off-state leakage of PtOx diodes enabled orders of magnitude less power dissipation than Pt ones for all duty cycles ≤0.5, indicating their great potential to realize low-loss and efficient, high-power β-Ga2O3 switches. The ZrO2 field-oxide further reduced edge leakage with a consistent increase in breakdown voltage. Device simulation demonstrated that the high permittivity of ZrO2 also led to the peak electric field occurring in β-Ga2O3 instead of the dielectric. These results indicate that the combined integration of oxidized-metal contacts to increase SBH and high-κ dielectric field plate to assist edge termination can be promising to enhance the performance of vertical β-Ga2O3 Schottky diodes.