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A novel transition from substrate integrated suspended line (SISL) to conductor backed coplanar waveguide (CBCPW) is proposed in this letter. The proposed transition utilizing the standard PCB techniques eliminates the drawbacks of the traditional suspended circuits and integrates the suspended circuits effectively. The new transition is a self-packaged system verified by both simulation and experiment results. Back-to-back transition structure has insertion loss of less than 0.6 dB and return loss of better than 15 dB from dc to 8 GHz.Index Terms-Conductor backed coplanar waveguide (CBCPW), printed circuit board (PCB), substrate integrated suspended line (SISL), transition.

One hundred nanometer thick Fe-Co-Ni material chips were prepared and isothermally annealed at 500, 600, and 700 °C, respectively. Pixel-by-pixel composition and structural mapping was performed by microbeam X-ray at synchrotron light source. Diffraction images were recorded at a rate of 1 pattern/s. The XRD patterns were automatically processed, phase-identified, and categorized by hierarchical clustering algorithm to construct the composition-phase map. The resulting maps are consistent with corresponding isothermal sections reported in the ASM Alloy Phase Diagram Database, verifying the effectiveness of the present approach in phase diagram construction.

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