Recent Progress in SISL Circuits and Systems: Review of Passive and Active Circuits Demonstrating SISL's Low Loss and Self-Packaging and Showcasing the Merits of Metallic, Shielded, Suspended Lines

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An n‐shaped antenna with multimode for wideband application based on substrate integrated suspended line (SISL) platform is presented using characteristic mode analysis (CMA). By exciting three modes simultaneously, a wideband characteristic is achieved. The size of the proposed antenna is 0.74 λ0 × 1.47 λ0 × 0.11 λ0 (where λ0 is the free‐space operating wavelength at the center frequency of 6.205 GHz). The antenna prototype is fabricated and measured. Experimental results show that in the band of 5.1–7.31 GHz, |S11| <−10 dB, and the realized gain is from 5.2 to 9.8 dBi which can be used for WLAN and 5G wireless communication system.

Section: Antenna Designmentioning

confidence: 91%

“…It is difficult to reduce the size of an antenna while maintaining wide bandwidth. Recently, advances in technology such as the substrate integrated suspended line (SISL) with the merits of self‐packaging, low cost, and low loss 9–11 have provided a new solution for antenna design.…”

Section: Introductionmentioning

confidence: 99%

An n‐shaped multimode wideband substrate integrated suspended line antenna using characteristic mode analysis

Tang

Luo

et al. 2021

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“…FR4 substrate is widely used in board-level circuits because of its low price, high mechanical stability and good insulation performance, 12 but it is difficult to be used in high-frequency circuits due to its high loss tangent. Substrate integrated suspended line (SISL) [13][14][15][16] circuits feature low loss using FR4 substrates because almost all the electromagnetic (EM) field is distributed in the lossless air rather than the lossy substrates. 12,13 Using FR4 substrate to design high-frequency circuits will have great advantages in terms of cost, especially in mass production.…”

Section: Introductionmentioning

confidence: 99%

A W‐Band Broadband Self‐Packaged Compact SISL Tripler using FR4 substrate

Zhang

Wang

et al. 2022

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A W‐band low‐cost and high output power tripler based on a substrate integrated suspended line (SISL) platform is presented in this paper. An accurate three‐dimensional electromagnetic model is established to characterize the high‐frequency parasitic effect of diodes, and the field‐circuit cosimulation method is employed to design the tripler. A SISL‐WR10 transition is designed and added in the output port to facilitate the test, and it also functions as a W‐band bandpass filter (BPF) to output the third harmonic, which avoids insertion loss caused by an additional BPF and makes the tripler more compact. The whole circuit of the tripler is fabricated on FR4 substrates, and it is self packaged. The measured results show that with 22 dBm input power, the tripler achieves 0–4.46 dBm output power from 75 to 106 GHz.

“…Due to the advantages of low loss, low dispersion, and integration flexibility, SISL has great potential to design millimeter-wave circuits and systems. 9 To test millimeterwave components based on the SISL platform and realize the interconnection between SISL and other planar transmission lines, it is urgent and necessary to design a wideband transition. A transition from conductor-backed coplanar waveguide (CBCPW) to SISL operating from dc to 8 GHz is proposed in Li et al, 10 and then a similar design operating from dc to 20 GHz is reported in Li et al 11 But it is quite difficult to further expand the bandwidth based on the transition scheme 10,11 due to the discontinuities.…”

Section: Introductionmentioning

confidence: 99%

An FR4‐based dc to 60 GHz substrate integrated suspended line to suspended coplanar waveguide transition

Wang

et al. 2021

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An FR4-based dc to 60 GHz transition from substrate integrated suspended line (SISL) to suspended coplanar waveguide (SCPW) is proposed in this letter. The design is fabricated using standard multilayer printed circuit boards (PCB) technology, and the substrates used are all low-cost FR4. Since the whole structure is in the suspended form, the bandwidth of the transition has been expanded three times when compared with the state of art. By using SISL with double-metal layer and patterned substrate, the loss of the transition is further reduced, and the conductor loss and dielectric loss have been individually analyzed. The results show that the proposed backto-back transition has an insertion loss of less than 2.7 dB and a return loss of better than 11.4 dB from dc to 60 GHz.