We describe a multi-purpose platform for the three-dimensional cultivation of tissues. The device is composed of polymer chips featuring a microstructured area of 1-2 cm(2). The chip is constructed either as a grid of micro-containers measuring 120-300 x 300 x 300 microm (h x l x w), or as an array of round recesses (300 microm diameter, 300 microm deep). The micro-containers may be separately equipped with addressable 3D-micro-electrodes, which allow for electrical stimulation of excitable cells and on-site measurements of electrochemically accessible parameters. The system is applicable for the cultivation of high cell densities of up to 8 x 10(6) cells and, because of the rectangular grid layout, allows the automated microscopical analysis of cultivated cells. More than 1000 micro-containers enable the parallel analysis of different parameters under superfusion/perfusion conditions. Using different polymer chips in combination with various types of bioreactors we demonstrated the principal suitability of the chip-based bioreactor for tissue culture applications. Primary and established cell lines have been successfully cultivated and analysed for functional properties. When cells were cultured in non-perfused chips, over time a considerable degree of apoptosis could be observed indicating the need for an active perfusion. The system presented here has also been applied for the differentiation analysis of pluripotent embryonic stem cells and may be suitable for the analysis of the stem cell niche.
This paper presents a fundamentally new approach for the manufacturing and the possible applications of lab on a chip devices, mainly in the form of disposable fluidic microchips for life sciences applications. The new technology approach is based on a novel microscale thermoforming of thin polymer films as core process. The flexibility not only of the semi-finished but partly also of the finished products in the form of film chips could enable future reel to reel processes in production but also in application. The central so-called 'microthermoforming' process can be surrounded by pairs of associated pre- and postprocesses for micro- and nanopatterned surface and bulk modification or functionalisation of the formed films. This new approach of microscale thermoforming of thin polymer film substrates overlaid with a split local modification of the films is called 'SMART', which stands for 'substrate modification and replication by thermoforming'. In the process, still on the unformed, plane film, the material modifications of the preprocess define the locations where later, then on the spatially formed film, the postprocess generates the final local modifications. So, one can obtain highly resolved modification patterns also on hardly accessible side walls and even behind undercuts. As a first application of the new technology, we present a flexible chip-sized scaffold for three dimensional cell cultivation in the form of a microcontainer array. The spatially warped container walls have been provided with micropores, cell adhesion micropatterns and thin film microelectrodes.
Purpose -The purpose of this paper is to present a summary of development work made in technical centres and on the subsequent customer qualification of copper filled through holes and blind microvias. Design/methodology/approach -Various copper deposition parameters were investigated in a small-scale production line which was then extended to full-scale production qualification in a horizontal conveyorised system. Samples of substrates with copper filled through holes were qualified at end-user facilities. Findings -The copper plating process may be used to replace an existing production process for printed circuit boards. The proposed system can give a more reliable result in terms of filling and technical capability for the produced substrate. Overall production cost savings are possible.Research limitations/implications -The technology is based on a copper plating electrolyte using a redox pair for copper replenishment. The results achieved depend on use of this system and on production equipment which can control the redox system and copper concentration within a tight range. Originality/value -The paper shows how the use of a horizontal production system with redox copper replenishment can achieve filling of though holes and blind microvias with reduced surface plated copper thickness. Reduction in the use of copper saves both resources and also reduces production costs. The process is proposed as an alternative to existing paste plugging processes, which are both cost and labour intensive.
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