A bonding technique that makes use of silver oxide particles with a reducing agent was developed for a high-temperature environment. The silver oxide particles are reduced using a reducing agent at 150°C, and the sintering of the silver nanoparticles which are produced occurs at this temperature. To investigate the reliability of the bond layer formed by the sintered silver, a power cycling test was performed on the module. The module survived more than 75,000 power cycles in a test with T jmax = 150°C (ΔT j = 120 K) while the number of cycles to failure for a soldered (Pb3.5Sn1.5Ag) power device didn't exceed 25,000 cycles. This result shows that the sintered silver bonding technique could be used to increase the lifetime of the power module by eliminating the solder layer.
A half‐pitch shifted priming cell structure to reduce address‐delay‐time degradation and lower power consumption has been developed. Discharge transition from a priming cell to a display cell occurred. The time constant of priming electron emission only from the priming cell did not degrade. Observed address‐delay‐time degradation in the display cell reduced.
To investigate the reliability of a sintered silver bonding layer obtained using silver-oxide paste, a power cycling test was performed. The module obtained using silver-oxide paste achieved 73,400 power cycles in a test with Tjmax = 150 °C (ΔTj = 120 °C), while a soldered (Pb3.5Sn1.5Ag) power module failed at 24,600 cycles. After the cycling test, a crack was observed in the Pb3.5Sn1.5Ag solder layer but not in the sintered silver layer. These results reveal that the sintered silver layer obtained using silver-oxide paste can treble the lifetime of a power module.
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