This paper presents the homoepitaxial growth of phase pure (010) β-Ga2O3 thin films on (010) β-Ga2O3 substrate by low pressure chemical vapor deposition. The effects of growth temperature on the surface morphology and crystal quality of the thin films were systematically investigated. The thin films were synthesized using high purity metallic gallium (Ga) and oxygen (O2) as precursors for gallium and oxygen, respectively. The surface morphology and structural properties of the thin films were characterized by atomic force microscopy, X-ray diffraction, and high resolution transmission electron microscopy. Material characterization indicates the growth temperature played an important role in controlling both surface morphology and crystal quality of the β-Ga2O3 thin films. The smallest root-mean-square surface roughness of ∼7 nm was for thin films grown at a temperature of 950 °C, whereas the highest growth rate (∼1.3 μm/h) with a fixed oxygen flow rate was obtained for the epitaxial layers grown at 850 °C.

An MOS transistor fabricated on (001) β-Ga 2 O 3 exfoliated from a commercial (−201) β-Ga 2 O 3 substrate is reported. A maximum drain current of 11.1 mA/mm was measured, and a non-destructive breakdown was reached around 80 V in the off state. Threshold voltage of +2.9 V was extracted at 0.1 V drain bias, and peak transconductance of 0.18 mS/mm was measured at V DS = 1 V, corresponding to a field effect mobility of 0.17 cm 2 /Vs. Hall effect and electron spin resonance data suggested that electron conductivity was due primarily to O vacancy donors (V O + ) with an estimated density of 2. The single-crystal monoclinic (β) phase of Ga 2 O 3 is an advantageous material for high-power, high-temperature electronic device applications due to its high energy gap (4.8-4.9 eV) and high breakdown field (8 MV/cm), yielding a nearly ten-fold higher Baliga figure of merit than that of 4H-SiC (BFOM Ga 2 O 3 = 3444, BFOM 4H-SiC = 300).1 Commercially available β-Ga 2 O 3 substrates enable the epitaxial growth of low defect density epitaxial β-Ga 2 O 3 by a number of methods, including chemical vapor deposition, hydride vapor phase epitaxy (HVPE), and molecular beam epitaxy (MBE), among others.2-6 Schottky barrier diodes (SBDs) based on Ga 2 O 3 have exhibited very low turn on voltage and reverse leakage current, suggesting that unintentionally doped Ga 2 O 3 has extremely low generation/recombination rates and thus a high photoconductive gain.7 Advances in doping control have enabled exceptional early reports of metal-and metal-insulatorgated field effect transistors (MOSFETs). Wong et al. demonstrated a field-plated β-Ga 2 O 3 MOSFET with a breakdown voltage of over 750 V using a Si-implanted channel.8 Most recently, Green and coworkers have reported a Ga 2 O 3 MOSFET with a Sn-doped channel and a 0.6 μm gate-drain spacing to operate at 200 V drain bias, experimentally demonstrating gate-drain fields in excess of 3 MV/cm. 9This excellent progress has positioned Ga 2 O 3 as a viable candidate for next generation material for power applications. However, no demonstration of normally-off operation, a key requirement for fail-safe operation of power switches, has been achieved or proposed to-date.From a practical perspective, development of Ga 2 O 3 transistors has been limited by the availability of device-quality epitaxial films. For this reason, early reports have exploited the relatively large a-plane lattice constant of β-Ga 2 O 3 (1.2 nm) in order to mechanically exfoliate thin films from the (001) plane of a substrate using the scotch tape method to fabricate back-gated devices. 10,11 We employed a similar method to transfer a thin (∼300 nm) Ga 2 O 3 flake onto a SiO 2 /Si substrate, 12 and performed a standard top-side insulated-gate process to fabricate a three-terminal device. We also utilized a high-k HfO 2 gate dielectric process, as only SiO 2 and Al 2 O 3 have been reported to-date. 13,14Experimental A thin sliver of Ga 2 O 3 was cleaved along the (001) face of an on-axis (−201), non-intentionally n-type doped (∼3 ×...

InN thin films possessing either a novel cubic or a hexagonal phase were grown by plasma-assisted atomic layer epitaxy on an a-plane sapphire, Si(111), and GaN/sapphire templates, simultaneously. Two ALE growth temperature windows were found between 175–185 °C and 220–260 °C, in which the growth process is self-limiting. In the lower temperature ALE window, InN on an a-plane sapphire crystallized in a face-centered cubic lattice with a NaCl type structure, which has never been previously reported. InN grown on other substrates formed the more common hexagonal phase. In the higher temperature ALE window, the InN films grown on all substrates were of hexagonal phase. The NaCl phase and the epitaxial nature of the InN thin films on the a-plane sapphire grown at 183 °C are confirmed independently by X-ray diffraction, transmission electron microscopy, and numerical simulations. These results are very promising and demonstrate the tremendous potential for the PA-ALE in the growth of crystalline III-N materials with novel phases unachievable by other deposition techniques.

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An ultrafast microwave annealing method, different from conventional thermal annealing, is used to activate Mg-implants in GaN layer. The x-ray diffraction measurements indicated complete disappearance of the defect sublattice peak, introduced by the implantation process for single-energy Mg-implantation, when the annealing was performed at Ն1400°C for 15 s. An increase in the intensity of Mg-acceptor related luminescence peak ͑at 3.26 eV͒ in the photoluminescence spectra confirms the Mg-acceptor activation in single-energy Mg-implanted GaN. In case of multiple-energy implantation, the implant generated defects persisted even after 1500°C / 15 s annealing, resulting in no net Mg-acceptor activation of the Mg-implant. The Mg-implant is relatively thermally stable and the sample surface roughness is 6 nm after 1500°C / 15 s annealing, using a 600 nm thick AlN cap. In situ Be-doped GaN films, after 1300°C / 5 s annealing have shown Be out-diffusion into the AlN layer and also in-diffusion toward the GaN/SiC interface. The in-diffusion and out-diffusion of the Be increased with increasing annealing temperature. In fact, after 1500°C / 5 s annealing, only a small fraction of in situ doped Be remained in the GaN layer, revealing the inadequateness of using Be-implantation for forming p-type doped layers in the GaN.

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