Currently, generation of solid waste per capita in Malaysia is about 1.1 kg/day. Over 26,500 t of solid waste is disposed almost solely through 166 operating landfills in the country every day. Despite the availability of other disposal methods, landfill is the most widely accepted and prevalent method for municipal solid waste (MSW) disposal in developing countries, including Malaysia. This is mainly ascribed to its inherent forte in terms cost saving and simpler operational mechanism. However, there is a downside. Environmental pollution caused by the landfill leachate has been one of the typical dilemmas of landfilling method. Leachate is the liquid produced when water percolates through solid waste and contains dissolved or suspended materials from various disposed materials and biodecomposition processes. It is often a high-strength wastewater with extreme pH, chemical oxygen demand (COD), biochemical oxygen demand (BOD), inorganic salts and toxicity. Its composition differs over the time and space within a particular landfill, influenced by a broad spectrum of factors, namely waste composition, landfilling practice (solid waste contouring and compacting), local climatic conditions, landfill's physico-chemical conditions, biogeochemistry and landfill age. This paper summarises an overview of landfill operation and leachate treatment availability reported in literature: a broad spectrum of landfill management opportunity, leachate parameter discussions and the way forward of landfill leachate treatment applicability.

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Abstract. Construction is one of an important industry which contributes to the economic growth in Malaysia. However, it has been revealed that 79.5 percent and 66.7 percent of the public and private projects were not completed within the time specified in the contracts out of 359 projects in Malaysia. Therefore, the purpose of this study is to investigate the delay factor caused project delay at rural area. A 5-points Likert scale questionnaire survey were answered by 111 respondents which having experience with rural construction project. The questionnaire data were analysed by using Relative Importance Index (RII). Five top factors were determined from this study based on their RII values which are improper construction method implemented by contractor, weather condition, difficulties in providing delivery to site, breakdown of site equipment, and poor qualification of contractor's technical staffs.

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Purpose The purpose of the study is to investigate the spatial aspects of underfill flow during the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump (CLJ). Furthermore, a spatial-based void formation mechanism during the underfill flow was formulated. Design/methodology/approach The meniscus evolution of underfill fluid subtended between the bump array and the CLJ phenomenon were visualized numerically using the micro-mesh unit cell approach. Additionally, the meniscus evolution and CLJ phenomenon were modelled analytically based on the formulation of capillary physics. Meanwhile, the mechanism of void formation was explained numerically and analytically. Findings Both the proposed analytical and current numerical findings achieved great consensus and were well-validated experimentally. The variation effects of bump pitch on the spatial aspects were analyzed and found that the meniscus arc radius and filling distance increase with the pitch, while the subtended angle of meniscus arc is invariant with the pitch size. For larger pitch, the jump occurs further away from the bump entrance and takes longer time to attain the equilibrium meniscus. This inferred that the concavity of meniscus arc was influenced by the bump pitch. On the voiding mechanism, air void was formed from the air entrapment because of the fluid-bump interaction. Smaller voids tend to merge into a bigger void through necking and, subsequently, propagate along the underfill flow. Practical implications The microscopic spatial analysis of underfill flow would explain fundamentally how the bump design will affect the macroscopic filling time. This not only provides alternative visualization tool to analyze flow pattern in the industry but also enables the development of accurate analytical filling time model. Moreover, the void formation mechanism gave substantial insights to understand the root causes of void defects and allow possible solutions to be formulated to tackle this issue. Additionally, the microfluidics sector could also benefit from these spatial analysis insights. Originality/value Spatial analysis on underfill flow is scarcely conducted, as the past research studies mainly emphasized on the temporal aspects. Additionally, this work presented a new mechanism on the void formation based on the fluid-bump interaction, in which the formation and propagation of micro-voids were numerically visualized for the first time. The findings from current work provided fundamental information on the flow interaction between underfill fluid and solder bump to the package designers for optimization work and process enhancement.