This paper investigates the melting phenomena, joining mechanism, microstructure evolution, and mechanical properties of the Al/Cu dissimilar joints made using resistance spot welding. A metallurgical bonding between Al and Cu is achieved via the reaction-diffusion between liquid Al and solid Cu (i.e. brazing mechanism). The reaction layer was featured by the in-situ formation of an ultra-thin Cu-rich Al-Cu intermetallic compound at the joint interface, on-cooling formation of coarse and thick θ-Al 2 Cu as the primary phase for hyper-eutectic solidification and formation of ultrafine lamellar α-Al/θ -Al 2 Cu eutectic structure. It is shown that the peak load and energy absorption of the Al/Cu joints are controlled by the effective length of the solid/liquid reaction zone and the thickness of the θ -Al 2 Cu primary solidification phase.
We demonstrate a nanostructure layer made of Ni80Fe20 (permalloy:Py) thin film conjugated MoS2 nano-flakes. Layers are made based on a single-step co-deposition of Py and MoS2 from a single solution where ionic Ni and Fe and MoS2 flakes co-exist. Synthesized thin films with MoS2 flakes show increasing coercivity and enhancement in magneto-optical Kerr effect. Ferromagnetic resonance linewidth as well as the damping parameter increaseed significantly compared to that of the Py layer due to the presence of MoS2. Raman spectroscopy and elemental mapping is used to show the quality of MoS2 within the Py thin film. Our synthesis method promises new opportunities for electrochemical production of functional spintronic-based devices.
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