A graphene-supported BNNT filler is fabricated via the in situ implanting of BNNTs on graphene, with the formation of high thermal conductivity nanocomposites via hot-pressing.
Thermal property is the important material property for engineering and analysis of insulating materials. In this study, thermal conductivities of insulating materials are determined and compared with the literature values. Lee's and Charlton's apparatus is used to measure this property of insulating materials by steady state technique. This apparatus gives more precise result for insulators that can be utilized for the further thermal related analysis. An experimental set up is prepared to determine and analyze thermal conductivities of insulating materials. The thermal conductivities are obtained by this apparatus are 0.797W/m.K, 0.3023 W/m.K and 0.057 W/m.K for borosilicate glass, styrene butadiene rubber, and polyolefin foam faced aluminum foil respectively. The experimental results are found (9-30) % deviation from the literature values.
The development of thermal conduction polymer‐based composites is important to solve the heat dissipation of electronic instruments under overheating conditions. The construction of thermal conductive pathways in composites and the reduction of contact resistance between fillers are crucial for concerning excellent thermal conduction properties. Herein, the oriented coherent thermal conductive network in composites is successfully developed via the in situ growth of carbon nanotubes (CNTs) into boron nitride nanosheets (BNNSs) skeleton prepared from ice‐templated. The thermal conductivity of composites reaches 3.21 W m−1 K−1 approximately low filler loading of 9.86 vol%, due to the formation of the covalent bonding between CNTs and BNNSs as reducing the thermal contact resistance by one order of magnitude. More importantly, non‐equilibrium molecular dynamics (NEMD) simulations are carried out to demonstrate the influence of CNTs in elevating the heat conductivity between BNNSs. Meanwhile, the volume resistivity of composites up to 1015 Ω cm far met the requirement of electrical insulation. This study provided a valuable idea for the design of thermal management materials for potential applications in integrated circuits.
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