Construction of Oriented Interconnected BNNS Skeleton by Self‐Growing CNTs Leading High Thermal Conductivity

Abstract

The development of thermal conduction polymer‐based composites is important to solve the heat dissipation of electronic instruments under overheating conditions. The construction of thermal conductive pathways in composites and the reduction of contact resistance between fillers are crucial for concerning excellent thermal conduction properties. Herein, the oriented coherent thermal conductive network in composites is successfully developed via the in situ growth of carbon nanotubes (CNTs) into boron nitride nanosheets (BNNSs) skeleton prepared from ice‐templated. The thermal conductivity of composites reaches 3.21 W m−1 K−1 approximately low filler loading of 9.86 vol%, due to the formation of the covalent bonding between CNTs and BNNSs as reducing the thermal contact resistance by one order of magnitude. More importantly, non‐equilibrium molecular dynamics (NEMD) simulations are carried out to demonstrate the influence of CNTs in elevating the heat conductivity between BNNSs. Meanwhile, the volume resistivity of composites up to 1015 Ω cm far met the requirement of electrical insulation. This study provided a valuable idea for the design of thermal management materials for potential applications in integrated circuits.

Thermally conductive polymer-based composites: fundamentals, progress and flame retardancy/anti-electromagnetic interference design

“…h-BN was ball-milled in an aqueous solution of urea to graft amino groups onto the edge of h-BN, so that the interfacial thermal resistance between h-BN and the polymer matrix might be reduced. 86 ZIF-67 grew on the surface of h-BN, which could serve as a catalyzer to change the carbon source into carbon nanotubes at 900 1C in an argon gas environment. An aligned 3D BN and carbon nanotube network was finally produced through freeze casting and freeze-drying technologies.…”

“…Some ceramic materials, for instance metal oxides such as Al 2 O 3 , MgO, and BeO, BN, AlN, Si 3 N 4 , BN, and SiC, not only have high thermal conductivity, but also have excellent insulation and mechanical properties, high temperature resistance as well as chemical corrosion resistance. [85][86][87][88][89] Therefore, ceramic-based thermally conductive fillers are mainly used for the preparation of electrically insulated thermally conductive polymer-based composites for the thermal conductivity demand in applications with high electrical insulation requirements. The thermal conductivities of common ceramics are shown in Table 3.…”

Hierarchically Flexible Polyamide Composite Films for Thermal Management and Electromagnetic Shielding

“…There are many preparation methods for composite films with TC and electromagnetic shielding properties, such as melt blending, , spin coating, , hot pressing, , and other methods to introduce multifunctional metal or carbon materials into the polymer matrix. , However, the simple mixing of fillers and polymer will form an island structure, resulting in large thermal resistance at the interface, which makes the formation of an effective thermal conduction path difficult, and the high content of filler will also lead to the deterioration of the mechanical properties and processability of the composites.…”

Design of Interconnected Carbon Fiber Thermal Management Composites with Effective EMI Shielding Activity

“…Therefore, isotropic heat transfer of CFC can be realized by covalently connecting CFs to obtain a 3D interlinked structure. In view of the fact that carbon nanotubes (CNTs) transformed from ZIF-67 (zeolitic imidazolate frameworks is a subclass of metal organic frameworks) developed by the author to covalently connect the thermal conductivity filler, the isotropic structure in CFC can be finished by performing the same processes. , …”

“…In view of the fact that carbon nanotubes (CNTs) transformed from ZIF-67 (zeolitic imidazolate frameworks is a subclass of metal organic frameworks) developed by the author to covalently connect the thermal conductivity filler, the isotropic structure in CFC can be finished by performing the same processes. 17,18 Electromagnetic interference (EMI), negative effects on human health and device performance due to the high frequency and wide application of electronic equipment, has become another important issue that needs to be solved urgently. 19 The reflection and absorption of electromagnetic wave (EMW) are caused by interaction between migration charge carrier, and electric/magnetic dipoles can achieve efficient EMI shielding.…”