Superhydrophobic pillar arrays, which can generate the droplet pancake bouncing phenomenon with reduced liquid-solid contact time, have huge application prospects in anti-icing of aircraft wings from freezing rain. However, the previously reported pillar arrays, suitable for obtaining pancake bouncing, have a diameter ≤100 μm and height-diameter ratio >10, which are difficult to fabricate over a large area. Here, we have systematically studied the influence of the dimension of the superhydrophobic pillar arrays on the bouncing dynamics of water droplets. We show that the typical pancake bouncing with 57.8% reduction in contact time with the surface was observed on the superhydrophobic pillar arrays with 1.05 mm diameter, 0.8 mm height, and 0.25 mm space. Such pillar arrays with millimeter diameter and <1 height-diameter ratio can be easily fabricated over large areas. Further, a simple replication-spraying method was developed for the large-area fabrication of the superhydrophobic pillar arrays to induce pancake bouncing. No sacrificial layer was needed to reduce the adhesion in the replication processes. Since the bouncing dynamics were rather sensitive to the space between the pillars, a method to control the contact time, bouncing shape, horizontal bouncing direction, and reversible switch between pancake bouncing and conventional bouncing was realized by adjusting the inclination angle of the shape memory polymer pillars.

Patterns with controllable adhesion on superhydrophobic areas have various biomedical and chemical applications. Electrolyte jet machining technique (EJM), an electrochemical machining method, was firstly exploited in constructing dimples with various profiles on the superhydrophobic Al alloy surface using different processing parameters. Sliding angles of water droplets on those dimples firstly increased and then stabilized at a certain value with the increase of the processing time or the applied voltages of the EJM, indicating that surfaces with different adhesion force could be obtained by regulating the processing parameters. The contact angle hysteresis and the adhesion force that restricts the droplet from sliding off were investigated through experiments. The results show that the adhesion force could be well described using the classical Furmidge equation. On account of this controllable adhesion force, water droplets could either be firmly pinned to the surface, forming various patterns or slide off at designed tilting angles at specified positions on a superhydrophobic surface. Such dimples on superhydrophopbic surfaces can be applied in water harvesting, biochemical analysis and lab-on-chip devices.

Superhydrophobic–superoleophilic sponges equipped on oil skimmers are obtained after being immersed in a copper stearate solution.

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Noncircular holes on the surface of turbine rotor blades are usually machined by electrodischarge machining. A recast layer containing numerous micropores and microcracks is easily generated during the electrodischarge machining process due to the rapid heating and cooling effects, which restrict the wide applications of noncircular holes in aerospace and aircraft industries. Owing to the outstanding advantages of pulse electrochemical machining, electrodischarge machining-pulse electrochemical machining combined technique is provided to improve the overall quality of electrodischarge machining-drilled holes. The influence of pulse electrochemical machining processing parameters on the surface roughness and the influence of the electrodischarge machining-pulse electrochemical machining method on the surface quality and accuracy of holes have been studied experimentally. The results indicate that the pulse electrochemical machining processing time for complete removal of the recast layer decreases with the increase in the pulse electrochemical machining current. The low pulse electrochemical machining current results in uneven dissolution of the recast layer, while the higher pulse electrochemical machining current induces relatively homogeneous dissolution. The surface roughness is reduced from 4.277 to 0.299 mm, and the hole taper induced by top-down electrodischarge machining process was reduced from 1.04°to 0.17°after pulse electrochemical machining. On account of the advantages of electrodischarge machining and the pulse electrochemical machining, the electrodischarge machining-pulse electrochemical machining combined technique could be applied for machining noncircular holes with high shape accuracy and surface quality.

Abstract:The microarray structured surfaces in the nature, such as shark skin and lotus leaf, have good waterproof and anti-friction performances. Besides, the microarray structures above also have good application prospects in heat exchange and biomedicine. Compared to traditional machining with problems of high cost and low efficiency, the mask chemical etching method has the advantages that no residual stress exists when processing, and can be employed for large area preparation with high machining efficiency. We propose to prepare micro cylindrical array structures on copper substrate by mask chemical etching method, and research influences of processing parameters on the size of microarray structures.