One of the most important promises of capacitive micromachined ultrasonic transducer (CMUT) technology is integration with electronics. This approach is required to minimize the parasitic capacitances in the receive mode, especially in catheter based volumetric imaging arrays where the elements need to be small. Furthermore, optimization of the available silicon area and minimized number of connections occurs when the CMUTs are fabricated directly above the associated electronics. Here, we describe successful fabrication and performance evaluation of CMUT arrays for intravascular imaging on custom designed CMOS receiver electronics from a commercial IC foundry. The CMUT on CMOS process starts with surface isolation and mechanical planarization of the CMOS electronics to reduce topography. The rest of the CMUT fabrication is achieved by modifying a low temperature micromachining process through the addition of a single mask and developing a dry etching step to produce sloped sidewalls for simple and reliable CMUT to CMOS interconnection. This CMUT to CMOS interconnect method reduced the parasitic capacitance by a factor of 200 when compared with a standard wire bonding method. Characterization experiments indicate that the CMUT on CMOS elements are uniform in frequency response and are similar to CMUTs simultaneously fabricated on standard silicon wafers without electronics integration. Experiments on a 1.6 mm diameter dual-ring CMUT array with a 15 MHz center frequency show that both the CMUTs and the integrated CMOS electronics are fully functional. The SNR measurements indicate that the performance is adequate for imaging CTOs located 1 cm away from the CMUT array.
When capacitive micromachined ultrasonic transducers (CMUTs) are monolithically integrated with custom-designed low-noise electronics, the output noise of the system can be dominated by the CMUT thermal-mechanical noise both in air and in immersion even for devices with low capacitance. Since the thermal-mechanical noise can be related to the electrical admittance of the CMUTs, this provides an effective means of device characterization. This approach yields a novel method to test the functionality and uniformity of CMUT arrays and the integrated electronics where a direct connection to CMUT array element terminals is not available. These measurements can be performed in air at the wafer level, suitable for batch manufacturing and testing. We demonstrate this method on the elements of an 800-μm diameter CMUT-on-CMOS array designed for intravascular imaging in the 10-20 MHz range. Noise measurements in air show the expected resonance behavior and spring softening effects. Noise measurements in immersion for the same array provide useful information on both the acoustic cross talk and radiation properties of the CMUT array elements. The good agreement between a CMUT model based on finite difference and boundary element method and the noise measurements validates the model and indicates that the output noise is indeed dominated by thermal-mechanical noise. The measurement method can be exploited to implement CMUT based passive sensors to measure immersion medium properties, or other parameters affecting the electro-mechanics of the CMUT structure.
Designing a mechanically flexible catheter based volumetric ultrasonic imaging device for intravascular and intracardiac imaging is challenging due to small transducer area and limited number of cables. With a few parallel channels, synthetic phased array processing is necessary to acquire data from a large number of transducer elements. This increases the data collection time and hence reduces frame rate and causes artifacts due to tissue-transducer motion. Some of these drawbacks can be resolved by different array designs offered by CMUT-on-CMOS approach. We recently implemented a 2.1-mm diameter single chip 10 MHz dual ring CMUT-on-CMOS array for forward looking ICE with 64-transmit and 56-receive elements along with associated electronics. These volumetric arrays have the small element size required by high operating frequencies and achieve sub mm resolution, but the system would be susceptible to motion artifacts. To enable real time imaging with high SNR, we designed novel arrays consisting of multiple defocused annular rings for transmit aperture and a single ring receive array. The annular transmit rings are utilized to act as a high power element by focusing to a virtual ring shaped line behind the aperture. In this case, image reconstruction is performed by only receive beamforming, reducing total required firing steps from 896 to 14 with a trade-off in image resolution. The SNR of system is improved more than 5 dB for the same frequency and frame rate as compared to the dual ring array, which can be utilized to achieve the same resolution by increasing the operating frequency.
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