We studied the possibility of forming ultrahigh-density fine dot arrays using 30-keV electron beam (EB) drawing for 2 Tbit/in.2 patterned media. We investigated the effects of calixarene resist thickness and exposure dosage on the drawing of dot arrays with a minimum pitch. We found that the 13-nm-thick calixarene resist was very suitable for forming resist dot arrays with a pitch of 20 nm. Furthermore, the allowable region of proper exposure dosage became narrow as the pitch decreased. It is clarified that there exists a minimum pitch of 18 nm in drawing ultrahigh density fine dot arrays with a 13-nm-thick resist.
We studied the possibility of achieving very fine-pitch dot arrays with a pitch of 20 nm × 20 nm using 30 keV electron beam (EB) drawing on negative calixarene resist. In order to form such patterns, we studied the dependence on resist thickness of the dot size and the packing. We propose EB drawing on an extremely thin film for very highly packed dot-array formation. Our experimental results demonstrate the possibility of forming highly packed dot-array patterns with a pitch of 20 nm × 20 nm and a resist thickness of about 13 nm, which corresponds to about 1.6 Tbits in(-2).
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