Ultra fine oxidized titanium (Ti) lines 18 nm wide and 3 nm high have been formed on the surface of a 4 nm Ti layer on a SiO2/Si substrate using the scanning tunneling microscope [STM] tip as a selective anodization electrode. The dependence of the size of the oxidized titanium line on the various parameters is investigated. The formed oxidized titanium line has resistivity of 2×104 ohm cm, which is a value seven orders of magnitude higher than that of the deposited Ti layer. The oxidized Ti line is used in the planar type metal-insulator-metal [MIM] diode, and works as an energy barrier for the electron. The energy barrier height of the oxidized Ti line is found to be δE
g=0.25 eV.
We demonstrate a SiC trench MOSFET with an integrated low Von unipolar heterojunction diode (MOSHJD). A region of the heterojunction diode (HJD) was fabricated in a trench with p+-type poly-crystalline silicon on an n--type epitaxial layer of 4H-SiC. The measured on-resistance (Ron) of the transistor action was 15 mΩcm2. The measured Von of the diode action was 2.2 V at a forward current density of 100 A/cm2. The fabrication process of the MOSHJD is simple. First, the trenches of the MOSFET region and the HJD region are formed simultaneously; then poly-crystalline silicon is deposited to form the gate electrode of the MOSFET region and the anode electrode of the HJD region at the same time.
We fabricated 4H-SiC vertical MOSFETs with contacts to the source, p-well and polycrystalline silicon (polysilicon) gate and these were simultaneously formed from a single material, using one deposition and a single contact annealing process. Typical specific contact resistances of 4.8×10 -5 cm 2 for the n + source region, 1.5×10 -6 cm 2 for the gate polysilicon and 5.2×10 -4 cm 2 for the p-well contact region were obtained using Al/Ni (Al~6%) as the contact metal. Also, the static characteristics of the vertical MOSFETs indicated that the MOS interface can withstand an even higher temperature process such as that used in ohmic-contact formation.
We demonstrate a heterojunction diode (HJD) fabricated with p + -type polycrystalline silicon on an n --type epitaxial layer of 4H-SiC. The HJD achieved extremely low V on and high reverse blocking voltage compared with a SiC Schottky barrier diode (SBD). The HJD shows good diode characteristics for temperatures ranging up to 200°C. Measured switching characteristics of the HJD exhibit almost zero reverse recovery similar to that of the SBD.
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