This paper presents an approach to the test generation for synchronous sequential circuits. This approach utilizes an extended logic simulation, called 7eal-valued logic simulation, and solves the sequential test generation problem as a kind of optimization problem. The approach has the possibility of high speed test generation, because high speed processing techniques, such as, vector processing, parallel processing, and so on, can be efficiently applied to the most time-consuming part of this approach. Experimental results for ISCAS'89 benchmark sequential circuits also illustrate the eficiency of this approach.
The effect of a heat treatment was studied on the sodium isotopic exchange rate between the hydrous niobium(V) oxide in the Na+ form and aqueous solutions. The rate was controlled by the particle diffusion of sodium ions and increased with the heat-treatment temperature. The increase in the rate for the exchanger heat-treated at 200 °C was due to a decrease in the effective particle radius brought about by cracks which developed in the particles. A further increase in the rate at temperatures higher than 200 °C could be explained in terms of an increase in the Na+-diffusion coefficient, which was produced by an increase in the pore size responsinble for the movement of sodium ions.
SUMMARYThis research paper proposes a novel method for estimating the cross-sectional shape of an LSI wafer from a stereo image of an electron microscope. Three-dimensional measurement of an LSI wafer is critical in systems that perform nondestructive dimensional measurement of integrated circuits. In this method, the secondary electron intensity is converted to a three-dimensional shape by using the relationship between the three-dimensional shape and the secondary electron intensity produced when an electron beam is directed to an LSI wafer. A three-dimensional shape can be restored with greater detail by employing an energy minimization method. As a result, the proposed method can stably restore a detailed three-dimensional shape in comparison with the conventional stereo matching method. Since the proposed method restores a three-dimensional shape using a process that is the inverse of the stereo matching method, the proposed method is called the "inverse stereo matching method," and experimental results obtained using an electron micrograph taken of the LSI wafer show the effectiveness of the proposed method.
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