Fabrication of transition metal dichalcogenides (TMDCs) via metalorganic chemical vapor deposition (MOCVD) represents one of the most attractive routes to large-scale 2D material layers. Although good homogeneity and electrical conductance have been reported recently, the relation between growth parameters and photoluminescence (PL) intensity-one of the most important parameters for optoelectronic applications-has not yet been discussed for MOCVD TMDCs. In this work, MoS is grown via MOCVD on sapphire (0001) substrates using molybdenum hexacarbonyl (Mo(CO), MCO) and di-tert-butyl sulphide as precursor materials. A prebake step under H atmosphere combined with a reduced MCO precursor flow increases the crystal grain size by one order of magnitude and strongly enhances PL intensity with a clear correlation to the grain size. A decrease of the linewidth of both Raman resonances and PL spectra down to full width at half maxima of 3.2 cm for the E Raman mode and 60 meV for the overall PL spectrum indicate a reduced defect density at optimized growth conditions.
The influence of the main growth parameters on the growth mechanism and film formation processes during metalorganic vapor-phase epitaxy (MOVPE) of two-dimensional MoS 2 on sapphire (0001) have been investigated. Deposition was performed using molybdenum hexacarbonyl and di-tert-butyl sulfide as metalorganic precursors in a horizontal hot-wall MOVPE reactor from AIXTRON. The structural properties of the MoS 2 films were analyzed by atomic force microscopy, scanning electron microscopy, and Raman spectroscopy. It was found that a substrate prebake step prior to growth reduced the nucleation density of the polycrystalline film. Simultaneously, the size of the MoS 2 domains increased and the formation of parasitic carbonaceous film was suppressed. Additionally, the influence of growth parameters such as reactor pressure and surface temperature is discussed. An upper limit for these parameters was found, beyond which strong parasitic deposition or incorporation of carbon into MoS 2 took place. This carbon contamination became significant at reactor pressure above 100 hPa and temperature above 900°C.
GaN-based high electron mobility transistors (HEMT) on Si (111) substrates have large potential for applications in the 5G telecommunication field. However, for this potential to be fully realized, all loss mechanisms need to be minimized. It is known that typical metal-organic chemical vapor deposition (MOCVD) processes used to grow the GaN epitaxial layers can cause considerable parasitic conductivity at the interface of the AlN nucleation layer to the high-resistivity Si substrate, leading to reduced gain and power added efficiency in amplifiers. Reducing this parasitic conductivity is hence of utmost importance to render GaN-on-Si a significant contributor to next-generation 5G power amplifier technology. In this work, we employ secondary ion mass spectroscopy, spreading resistance profiling and insertion loss measurements up to 28 GHz using coplanar waveguides fabricated on the epitaxial layer stacks to study the origin and characterize the parasitic conductivity. While a single heat-up process in an AIXTRON G5+ reactor chamber cleaned using Cl2 does not introduce any extra dopants in the Si substrate, the epitaxial growth of (Al,Ga)N-based HEMT buffer layer stacks leads to the diffusion of Al and, to a lower extent, Ga acceptors into the Si substrate. Optimization of the MOCVD process towards lower growth temperatures leads to a strong reduction of density of diffused acceptors. This reduction goes in line with a significant decrease of the insertion loss from 0.45 dB mm −1 to only 0.20 dB mm −1 at a frequency of 28 GHz.
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