Primary amine‐based plasma polymer films (NH2‐PPF) were synthesized using plasma polymerization of allylamine in continuous wave (CW) and pulsed radio‐frequency (RF) modes. Plasma chemistry, studied by residual gas analysis mass spectrometry, revealed that the precursor fragmentation is a function of the equivalent power (Peq) dissipated in the discharge, independently of the plasma mode used. X‐ray photoelectron spectroscopy combined with time‐of‐flight secondary ion mass spectrometry suggests as the precursor fragmentation in the plasma increases: (i) a decrease of the primary amine concentration in the NH2‐PPF (%NH2) and (ii) an increase of the cross‐linking degree. For a given Peq, similar to the precursor fragmentation in the plasma, the NH2‐PPF characteristics were found to be independent of the plasma mode used. Therefore, the main advantage of using pulsed RF processes over CW ones is the possibility to work at very low Peq which enables low precursor fragmentation, optimization of %NH2, and reduction of the film cross‐linking degree. The chemical composition and the cross‐linking degree of the NH2‐PPF synthesized by allylamine plasma polymerization can thus be tailored by adjusting the equivalent RF power injected in the plasma.
High-power pulsed magnetron discharges have drawn an increasing interest as an approach to produce highly ionized metallic vapor. In this paper we propose to study how the plasma composition and the deposition rate are influenced by the pulse duration. The plasma is studied by time-resolved optical emission and absorption spectroscopies and the deposition rate is controlled thanks to a quartz microbalance. The pulse length is varied between 2.5 and 20 s at 2 and 10 mTorr in pure argon. The sputtered material is titanium. For a constant discharge power, the deposition rate increases as the pulse length decreases. With 5 s pulse, for an average power of 300 W, the deposition rate is ϳ70% of the deposition rate obtained in direct current magnetron sputtering at the same power. The increase of deposition rate can be related to the sputtering regime. For long pulses, self-sputtering seems to occur as demonstrated by time-resolved optical emission diagnostic of the discharge. In contrary, the metallic vapor ionization rate, as determined by absorption measurements, diminishes as the pulses are shortened. Nevertheless, the ionization rate is in the range of 50% for 5 s pulses while it lies below 10% in the case of a classical continuous magnetron discharge.
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