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Prediction of void occurrence during capillary underfill encapsulation process is vital to avoid package failure due to incomplete filling during the encapsulation process. Two design variables, namely the gap height and package orientations, together with different types of industrial standard design of dispensing methods were identified as possible influences to the void formation in encapsulated package. In this paper, all these factors have been closely related to the void formation and subsequently the best chip design has been formulated to improve package reliability. From the study, air entrapment is clearly visualized in the experiment, which can be detrimental as it contains trapped oxygen, which can combust at high temperature. A series of experiments eventually showed higher possibility of air void formation by U-type dispensing method compared with the L-type dispensing method. In addition, it is found that the chip design parameters that include the scaling size and ball grid array orientation have an effect on the size of void formed. Our experimental findings were validated using lattice-Boltzmann method simulation and great consensus is found between both approaches. These findings provide additional insights to the electronic packaging developer to effectively reduce the formation of void during encapsulation process.

Purpose This paper aims to present experimental and finite volume method (FVM)-based simulation studies on the scaling effect on the capillary contact angle and entrant pressure for a three-dimensional encapsulation process of ball-grid array (BGA). Design/methodology/approach With the development of various sizes of BGA packages, the scaling effect of BGA model on capillary underfill (CUF) process is investigated together with the influences of different industrial standard solder bump arrangements and dispensing methods used as case study. Findings The experimental results agree well to the simulation findings with minimal deviation in filling time and similar flow front profiles for all setups. The results revealed that the capillary contact angle of flow front decreases in scale-up model with larger gap height observed and lengthens the encapsulation process. Statistical correlation studies are conducted and accurate regression equations are obtained to relate the gap height to the completion filling time and contact angle. CUF threshold capillary pressures were computed based on Leverett-J function and found to be increasing with the scale size of the package. Practical implications These statistical data provide accurate insights into the impact of BGA’s scale sizes to the CUF process that will be benefiting the future design of BGA package. This study provided electronic designers with profound understanding on the scaling effect in CUF process of BGA, which may be extended to the future development of miniature-sized BGA and multi-stack device. Originality/value This study relates the flow behaviour of encapsulant to its capillary contact angle and Leverett-J pressure threshold, in the CUF process of different BGA and dispensing conditions. To date, no research has been found to predict the threshold pressure on the gap between the chip and substrate.

This paper studies the three dimensional (3D) simulation of fluid flows through the ball grid array (BGA) to replicate the real underfill encapsulation process. The effect of different solder bump arrangements of BGA on the flow front, pressure and velocity of the fluid is investigated. The flow front, pressure and velocity for different time intervals are determined and analyzed for potential problems relating to solder bump damage. The simulation results from Lattice Boltzmann Method (LBM) code will be validated with experimental findings as well as the conventional Finite Volume Method (FVM) code to ensure highly accurate simulation setup. Based on the findings, good agreement can be seen between LBM and FVM simulations as well as the experimental observations. It was shown that only LBM is capable of capturing the micro-voids formation. This study also shows an increasing trend in fluid filling time for BGA with perimeter, middle empty and full orientations. The perimeter orientation has a higher pressure fluid at the middle region of BGA surface compared to middle empty and full orientation. This research would shed new light for a highly accurate simulation of encapsulation process using LBM and help to further increase the reliability of the package produced.

In this paper, the discrete phase model (DPM) was introduced to study the fuel injector cavitations process and the macro spray characteristic of three different types of nozzle spray shape with diesel and hybrid biofuel blend for several injection pressures and backpressures. The three types of nozzle spray shapes used were circle, elliptical A type, and elliptical B type. The cavitations’ flows inside the injector nozzles were simulated with Computer Fluid Dynamics (CFD) simulations using the cavitations mixture approach. The effect of nozzle spray shape towards the spray characteristic of hybrid biofuel blends is analyzed and compared with the standard diesel. Furthermore, a verification and validation from both the experimental results and numerical results are also presented. The nozzle flow simulation results indicated that the fuel type did not affect the cavitation area vastly, but were more dependent on the nozzle spray shape. In addition, the spray width of the elliptical nozzle shape was higher as compared to the circular spray. Moreover, as the backpressure increased, the spray width downstream increased as well. The spray tip penetration for the elliptical nozzle shape was shorter than the circular nozzle shape due to circular nozzles having smaller nozzle widths and lesser spray cone angles. Thus, this resulted in smaller aerodynamic drag.

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