Effect of ILU dispensing types for different solder bump arrangements on CUF encapsulation process

Abas, Aizat; Haslinda,; Ishak, M. H. H.; Nurfatin, A S; Abdullah, M. Z.; Ani, F. Che

doi:10.1016/j.mee.2016.06.010

Cited by 29 publications

(28 citation statements)

References 20 publications

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“…Thus, the usage of scaled-up BGA models as a replacement of actual sized device to enhance the visualization aspects in the study of CUF flow is valid as the relative deviation in visualized flow fronts in scaled-up models is within 10%. Furthermore, our validations study does compare well with that reported by Aizat et al [8] in Fig. 5.…”

Section: Validations Of Scaled-up Bga Modelsupporting

confidence: 91%

“…1, the CUF encapsulation process of BGA flip chip is carried out by dispensing a controlled amount of underfill epoxy mold (EMC) at one side and the encapsulant will flow into the gap between flip-chip and substrate via capillary action. The separation between flip chip and substrate is known as the gap height and is effectively the parameter that will define the strength of the capillary flow [8,13]. In this study, a finite volume method (FVM) based numerical simulation is used to visualize the three-dimensional CUF flow in middle empty BGA that is subjected under L-type dispensing method.…”

Section: Problem Descriptionsmentioning

confidence: 99%

“…It had been reported that the shape and arrangement of solder bumps in flip chip are seen as the most influential factors in determining the outcome of the CUF process [9]. The CUF filling time of middle empty BGA is found to be shorter compared to the full array BGA and has relatively low number of voids formed [6,8].…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Comparative Study of the Scaling Effect on Pressure Profiles in Capillary Underfill Process

Ng¹,

Abas²,

Abdullah³

et al. 2017

IOP Conf. Ser.: Mater. Sci. Eng.

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Section: Validations Of Scaled-up Bga Modelsupporting

confidence: 91%

Section: Problem Descriptionsmentioning

confidence: 99%

See 1 more Smart Citation

Comparative Study of the Scaling Effect on Pressure Profiles in Capillary Underfill Process

Ng¹,

Abas²,

Abdullah³

et al. 2017

IOP Conf. Ser.: Mater. Sci. Eng.

Self Cite

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“…Ball grid arrays (BGA), being a type of SMT, use small solder balls to form connections between the electronic components and the PCB. BGA technology outshines other SMT counterparts like pin grid array (PGA), as it allows for higher interconnection density, better performance due to shorter leads, and better heat conduction (Abas et al, 2016a(Abas et al, , 2016b(Abas et al, , 2016cGan et al, 2019).…”

Section: Introductionmentioning

confidence: 99%

“…A smaller gap height between the chip and substrate will lead to longer filling times (Khor et al, 2012), larger pitch size on the bump array reduces the filling time (Yao et al, 2014), and with the solder bump arrangement, a perimeter array is reported to have faster filling flow compared to the middle-empty and full arrays (Khor et al, 2010;Abas et al, 2016aAbas et al, , 2016bAbas et al, , 2016c. Additionally, a Ushaped dispensing method has achieved the shortest filling time compared to I-shaped and L-shaped methods (Abas et al, 2016a(Abas et al, , 2016b(Abas et al, , 2016c. A force-induced process such as pressurized underfill is also reported to have a faster filling time compared to the conventional capillary method (Gan et al, 2019).…”

Section: Introductionmentioning

confidence: 99%

Effect of hourglass shape solder joints on underfill encapsulation process: numerical and experimental studies

Nashrudin

Gan

Abas

et al. 2020

SSMT

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Purpose In line with the recent development of flip-chip reliability and underfill process, this paper aims to comprehensively investigate the effect of different hourglass shape solder joint on underfill encapsulation process by mean of experimental and numerical method. Design/methodology/approach Lattice Boltzmann method (LBM) numerical was used for the three-dimensional simulation of underfill process. The effects of ball grid arrays (BGA) encapsulation process in terms of filling time of the fluid were investigated. Experiments were then carried out to validate the simulation results. Findings Hourglass shape solder joint has shown the shortest filling time for underfill process compared to truncated sphere. The underfill flow obtained from both simulation and experimental results are found to be in good agreement for the BGA model studied. The findings have also shown that the filling time of Hourglass 2 with parabolic shape gives faster filling time compared to the Hourglass 1 with hemisphere angle due to bigger cross-sectional area of void between the solder joints. Practical implications This paper provides reliable insights to the effect of hourglass shape BGA on the encapsulation process that will benefit future development of BGA packages. Originality/value LBM numerical method was implemented in this research to study the flow behaviour of an encapsulation process in term of filling time of hourglass shape BGA. To date, no research has been found to simulate the hourglass shape BGA using LBM.

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Effect of scale size, orientation type and dispensing method on void formation in the CUF encapsulation of BGA

Abas

Gan

et al. 2018

Sādhanā

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Prediction of void occurrence during capillary underfill encapsulation process is vital to avoid package failure due to incomplete filling during the encapsulation process. Two design variables, namely the gap height and package orientations, together with different types of industrial standard design of dispensing methods were identified as possible influences to the void formation in encapsulated package. In this paper, all these factors have been closely related to the void formation and subsequently the best chip design has been formulated to improve package reliability. From the study, air entrapment is clearly visualized in the experiment, which can be detrimental as it contains trapped oxygen, which can combust at high temperature. A series of experiments eventually showed higher possibility of air void formation by U-type dispensing method compared with the L-type dispensing method. In addition, it is found that the chip design parameters that include the scaling size and ball grid array orientation have an effect on the size of void formed. Our experimental findings were validated using lattice-Boltzmann method simulation and great consensus is found between both approaches. These findings provide additional insights to the electronic packaging developer to effectively reduce the formation of void during encapsulation process.

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Effect of ILU dispensing types for different solder bump arrangements on CUF encapsulation process

Cited by 29 publications

References 20 publications

Comparative Study of the Scaling Effect on Pressure Profiles in Capillary Underfill Process

Comparative Study of the Scaling Effect on Pressure Profiles in Capillary Underfill Process

Effect of hourglass shape solder joints on underfill encapsulation process: numerical and experimental studies

Effect of scale size, orientation type and dispensing method on void formation in the CUF encapsulation of BGA

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