This paper reports on the contact angle measurement analysis on a glass based surface for anodic bonding process cleaned by three distinct cleaning processes. The three types of glass based surface used were silica, pyrex, and soda lime glass. The three cleaning solutions tested in this experiment were RCA, piranha and acetone. Water Droplet Test (WDT) was done to analyze the contact angle of micro droplet on sample surface. It can be done by dropping a droplet of water in constant volume at the fixed height and angle. Only RCA process constantly decreases the contact angle value after cleaning. The compilations of data strongly proved that all samples become hydrophilic after RCA cleaning process. The solid surface is considered hydrophilic when water contact angle is smaller than 90°, and hydrophobic profile if the water contact angle is larger than 90°. Samples which undergo piranha and acetone cleaning did not prove any characteristic of hydrophilic or hydrophobic surface after cleaning.
Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress response of BGA solder ball during minimum vertical loading is analyzed through simulation. The stress response between two types of solder ball, Normal BGA and Micropearl BGA are compared. The Micropearl BGA is a solder ball which contains polymer core. The vertical loading forces used were 1N and 3N. A commercial computational software ANSYS was used for the simulation. The simulation results showed that the Normal BGA exhibited higher stress response.
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