A paradigm shift is apparent in Chip Multiprocessor (CMP) design, as the new performance bottleneck is becoming communication rather than computation. It is widely provisioned that number of cores on a single chip will reach thousands in a decade. Thus, new high rate interconnects such as optical or RF have been proposed by various researchers. However, these interconnect structures fail to provide essential requirements of heterogeneous on-chip traffic; bandwidth reconfigurability and broadcast support with a low complex design. In this paper we investigate the feasibility of a new Orthogonal Frequency Division Multiple Access (OFDMA) RF interconnect for the first time to the best of our knowledge. In addition we provide a novel dynamic bandwidth arbitration and modulation order selection policy, that is designed regarding the bimodal on-chip packets. The proposed approach decreases the average latency up to 3.5 times compared to conventional static approach.
This article presents a novel artificial skin technology based on the Electric Impedance Tomography (EIT) that employs multi-frequency currents for detecting the material and the temperature of objects in contact with piezoresistive sheets. To date, few artificial skins in the literature are capable of detecting an object’s material, e.g., wood, skin, leather, or plastic. EIT-based artificial skins have been employed mostly to detect the position of the contact but not its characteristics. Thanks to multi-frequency currents, our EIT-based artificial skin is capable of characterising the spectral profile of objects in contact and identifying an object’s material at ambient temperature. Moreover, our model is capable of detecting several levels of temperature (from −10 up to 60 °C) and can also maintain a certain accuracy for material identification. In addition to the known capabilities of EIT-based artificial skins concerning detecting pressure and location of objects, as well as being low cost, these two novel modalities demonstrate the potential of EIT-based artificial skins to achieve global tactile sensing.
International audience— This paper introduces flexible radio techniques inside integrated circuits in order to tackle the interconnect issue for many-core chips. We propose to take benefits from OFDMA for a RF-interconnect associated to a carrier allocation policy and adaptive modulation. A 20 GHz bandwidth is shared between 32 tilesets made of 32 tiles of 4 cores each, for a 4096 cores chip. We adopt a cognitive radio approach in order to dynamically share 1024 carriers, which avoids inter-cluster communication contention and decreases latency compared to conventional static approaches
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