Fluidic memristor devices have received tremendous attention for smooth resistance switching in artificial synapses due to the ion migration, concentration polarization, and redox reactions mechanism. Here we provide a novel method of preparing microfluidic memristor with superior stability, robustness, and ultralow cost. The structure of the two-terminal memristor device is Cu/[MMIm][Cl]: H 2 O/Cu, C 5 H 9 N 2 Cl. The ionic liquid of 1,3-dimethylimidazole chloride salt was used as representative IL to display resistive memory properties in a cylindrical microchannel of a capillary. The fabricated device shows hysteretic and bipolar I−V characteristics of memristor, which can respond to external stimuli, e.g., space length between two electrodes and applied voltage. Meanwhile, this artificial synapse can mimic synaptic plasticity under various pulse stimuli stably and repeatedly, which results in temporary memory behavior. Such device exhibits great potential value in the area of neuromorphic artificial synapses and memory states.
In electrochemical metallization memristor, the performance of resistive switching (RS) is influenced by the forming and fusing of conductive filaments within the dielectric layer. However, the growth of filaments, mostly, is unpredictable and uncontrollable. For this reason, to optimize ions migration paths in the dielectric layer itself in the Al/CuxS/Cu structure, uniform CuxS nanosheets films have been synthesized using anodization for various time spans. And the Al/CuxS/Cu devices show a low operating voltage of less than 0.3 V and stable RS performance. At the same time, a reversible negative differential resistance (NDR) behavior is also demonstrated. And then, the mechanism of repeatable coexistence of RS effect and NDR phenomenon is investigated exhaustively. Analyses suggest that the combined physical model of space-charge limited conduction (SCLC) mechanism and conductive filaments bias-induced migration of Cu ions within the CuxS dielectric layer is responsible for the RS operation, meanwhile, a Schottky barrier caused by copper vacancy at the CuxS/Cu interface is demonstrated to explain the NDR phenomenon. This work will develop a new way to optimize the performance of non-volatile memory with multiple physical attributes in the future.
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