Grown-in defects including oxygen precipitates and voids in nitrogen-doped Czochralski (NCZ) silicon have been investigated. It was found that the formation of grown-in oxygen precipitates in NCZ silicon can be divided into two stages. The large precipitates supposed to be enhanced by N2–V2–Ox complexes are generated around 1150 °C, while the small precipitates supposed to be enhanced by NmOn complexes are formed at 750 °C and below. Moreover, it was revealed that the oxygen precipitation behavior in the mixed-type NCZ silicon, which contains vacancy-type and interstitial-type defects distinguished by an OSF-ring in the oxidized wafer, is in sharp contrast to that in the mixed-type Czochralski (CZ) silicon, when subjected to one-step high temperature annealing (1050 °C/32 h) and two-step annealing (800 °C/4 h+1050 °C/16 h). On the other hand, it was found that, compared with CZ silicon, NCZ silicon has much denser crystal originated particles in smaller sizes, which were verified to have been annihilated at relatively lower temperatures. Based on the experimentally found phenomena, a tentative model that takes into account the formation of nitrogen-related complexes involving oxygen atoms and vacancies, void formation, and oxygen precipitation is presented.
Effect of nitrogen–oxygen (N–O) complexes on electrical properties of nitrogen-rich Czochralski (CZ) silicon grown in a nitrogen atmosphere has been investigated during annealing in the temperature range from 650 to 1000 °C. Electrical and low temperature (8 K) Fourier transmission infrared spectrometer (FTIR) measurements point out that the carrier concentration of the nitrogen-rich silicon varies with the annealing time and temperature, which is due to the formation and elimination of the N–O complexes acting as shallow thermal donors. After the N–O complexes are eliminated by annealing above 900 °C the carrier concentration of the nitrogen-rich silicon is stabilized. It is suggested that the N–O complexes attract more oxygen atoms to form new electrically inactive N–O clusters, and lose their electrical activity.
The mechanical strength in germanium-doped Czochralski silicon (GCz-Si) wafers has been investigated through the on-line warpage statistics analysis, indentation tests, and fracture structure measurements. It was found that the wafer warpage during manufacturing processes could be statistically suppressed by the germanium doping slightly. The enhancement effect of germanium doping on the mechanical strength in GCz-Si wafers could be shown obviously when the germanium concentration was higher than 1018cm−3. Meanwhile, the fracture strength for both the as-grown and the postannealed GCz-Si wafers might be greater compared to that of the conventional Czochralski (Cz-Si) wafers. Moreover, the generation and mobilization of the dislocations induced by indentation in Cz-Si wafers could be suppressed by the germanium doping. These phenomena are interpreted through a dislocation pinning-up effect associated with the smaller-sized higher-density oxygen precipitates formed in GCz-Si wafers.
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