Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are reported. Sensors from FBK (Italy) and IMB-CNM (Spain) have been tested before and after proton-irradiation to an equivalent fluence of about 1 × 10 16 n eq cm −2 (1 MeV equivalent neutrons). This is the first time that one single collecting electrode fine pitch 3D sensors are irradiated up to such fluence bump-bonded to a fine pitch ASIC. The preliminary analysis of the collected data shows no degradation on the hit detection efficiencies of the tested sensors after high energy proton irradiation, demonstrating the excellent radiation tolerance of the 3D pixel sensors. Thus, they will be excellent candidates for the extreme radiation environment at the innermost layers of the HL-LHC experiments.
A: Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about 1×10 16 neq cm −2 (1 MeV equivalent neutrons). All presented results are part of the CMS R&D activities in view of the pixel detector upgrade for the High Luminosity phase of the LHC at CERN (HL-LHC). A preliminary analysis of the collected data shows hit detection efficiencies around 97% measured after proton irradiation.
The CMS Silicon Strip Tracker is the largest silicon detector ever built. The high precision measurement of the track hit position, over a large radius range, determines the unprecedented performance of CMS tracking. The operational experience matured on this very complex detector up to the first half of 2011 and the current status are described here, including the powering system, cooling and the back-end electronics. The commissioning sequence to calibrate the detector is illustrated and results on the detector performance are presented.
The High Luminosity upgrade of the CERN LHC collider (HL-LHC) demands for a new, highradiation tolerant solid-state pixel sensor capable of surviving fluencies up to a few 10 16 n eq /cm 2 at ∼ 3 cm from the interaction point. To this extent the INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler (FBK), is aiming at the development of thin n-in-p type pixel sensors for the HL-LHC. The R&D covers both planar and single-sided 3D columnar pixel devices made with the Si-Si Direct Wafer Bonding technique, which allows for the production of sensors with 100 µm and 130 µm active thickness for planar sensors, and 130 µm for 3D sensors, the thinnest ones ever produced so far. Prototypes of hybrid modules, bumpbonded to the RD53A readout chip, have been tested on beam. First results on their performance before and after irradiation are presented.
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