Present work demonstrates the vertically double stacked nanosheet (NS) p-channel polycrystalline silicon (poly-Si) junctionless field-effect transistors (JL-FET) with tri-gate, omega-gate, and gate all around (GAA) structure. These structures offer more W eff per existing footprint and better parallel resistance, resulting in smaller total resistance. Also, the GAA stacked NS device shows superior electrical properties, including high Ion/Ioff ratio (>10 8), steep subthreshold swing (SS) = 100 mV/dec, very low drain-induced-barrier-lowering (DIBL) = 0.127 mV/V and usually off at Vg = 0 V, owing to superior gate controllability. More, the 3D TCAD simulation has applied for analysis of physical characteristics of the proposed devices. INDEX TERMS Gate all around, junctionless, nanosheet, multi gate, stacked FET.
We propose the use of Ge-cap quantum-well (QW) bulk FinFET for 5 nm CMOS integration, which is a Si channel wrapped with Ge around three sides of the fin channel. The simulation results show that the Ge-cap FinFET structure demonstrates better performance than pure Si, pure Ge, and Si-cap FinFET structures. By optimizing Si fin width and Ge-cap thickness, the on-state current of nFET and pFET can also be symmetric without changing the total fin width (F Wp = F Wn ). The electrons in Ge-cap nFinFET concentrate in the Si channel because of QWs formed in the lowest conduction band of the Ge and Si heterostructure, while the holes in Ge-cap pFinFET prefer to stay in Ge surfaces owing to QWs formed in the Ge valence band. The physics studies of this device have made the design rules relevant for the application of the CMOS inverter and static random access memory (SRAM) application technology.
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