Gauge Repeatability and Reproducibility (Gauge R&R , G.R.R) is of great importance for checking measurement system precision, traditional average-range G.R.R test involves equipment variation (EV) and appraiser variation (AV), which is not appropriate for current modern automatic measurement tools. In this paper, we designed different test experiments on film thickness (THK) and critical dimension (CD) metrology and statistically analyzed different variances impact on G.R.R. From THK G.R.R experiment ANOVA analysis, it can be seen that time interval and measurement process have no significant effect on G.R.R result, and the equipment repeatability variation is the major variation source. From CD G.R.R experiment ANOVA analysis, it can be checked that, G.R.R has significant time dependence of data collection due to test wafer changed. As a conclusion, not only appraiser’s variation but also time interval has less impact on metrology G.R.R of semiconductor wafer manufacturing process.
Raw material quality control is one of the most important subjects for foundry manufacturing process due to advanced technology in sub nano-meter. Therefore, how to effectively detect abnormality in early stage of raw material incoming or even at supplier sites becomes an increasingly challenging topic. Comparing with traditional management concept based on judgment inspections to just confirm if raw material meets customer’s specification requirement, this paper will focus on raw material incoming quality abnormality early detection via method of enhanced management about both supplier manufacturing process abnormality handling method and customer side raw material incoming performance warning limit setting to reduce foundry manufacturing risk.
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