A detailed kinetic study was performed to elucidate the mechanism of wet chemical etching of silicon in a HF-rich HF∕HNnormalO3 mixture. In contrast to earlier studies, the etch rates were determined by dissolution of only a few milligrams of silicon in carefully thermostatted acid mixtures in order to avoid a change in composition during the experiments and an uncontrolled warming of the etchant. All etch experiments were followed by chemical analytics. The etch rates were studied as a function of temperature, silicon content of the etchant (utilization), and stirring speeds. By choosing proper reaction conditions, intermediates of the reduction process of HNnormalO3 , such as normalN2normalO3 , were stabilized and spectroscopically identified. Furthermore, it was found that the nitrite ion concentration, measured in diluted etchant solution by ion chromatography, acts as a parameter for the reactive N(III) species in the concentrated etchant. Two different etch regimes were identified. In the region of high nitrite concentrations, the etch rate is apparently independent on the nitrite concentration. At lower nitrite concentrations, the etch rate decreases linearly with the nitrite concentration. Kinetic examinations showed that the reaction mechanism remains unchanged in both regimes. Furthermore, the kinetic parameters of nitrite decays were determined. The obtained results provide the first explanation of why an etch mixture of constant HF–HNnormalO3 ratio at given Si content can exhibit different etch behavior. A mechanistic model on the role of N(III) species and dissolved gases in the etching process including a suggestion of the rate-limiting step is presented. Consequences for technical applications are discussed.

The wet chemical etching of silicon using HNO 3 -rich HF/HNO 3 mixtures has been studied. The effect of different parameters on the etch rate of silicon, for example, the HF/HNO 3 mixing ratio, the silicon content of the etchant, temperature, and stirring speed in these solutions, has been examined and discussed in light of a previous study on etching in HF-rich HF/HNO 3 mixtures. Nitrogen(III) intermediates are generated owing to the dissolution of silicon and the decomposition if the solution is exposed to air. The nitrite ion concentration, measured in diluted etchant solution by ion chromatography, acts as a sum parameter for the reactive N(III) species in the concentrated etchant. The etch rate shows two different correlations to the nitrite concentration. In the region of high nitrite concentrations, the etch rate decreases slightly with decreasing nitrite concentration, whereas at lower nitrite concentrations, the etch rate increases linearly with further decreasing nitrite concentration. Stirring experiments and the determination of activation energies show that the etching of silicon in HNO 3 -rich etchants is controlled by diffusion. X-ray photoelectron spectroscopy measurements of the silicon surface after etching revealed a hydrogen termination independent of the concentration of reactive species and the content of HNO 3 in the etchant. Si-O containing surface species were not found. A combined electrochemical (injection of holes into the valence band of silicon) and chemical (Si-Si back-bond breaking by an attack of HF) reaction mechanism of silicon etching without generation of SiO 2 is proposed.

The role of intermediate species generated during wet chemical etching of silicon in a HF-rich HF/HNO3 mixture was studied by spectroscopic and analytical methods at 1 degrees C. The intermediate N2O3 was identified by its cobalt blue color and the characteristic features in its UV-vis and Raman spectra. Furthermore, a complex N(III) species (3NO+.NO3-) denoted as [N4O6(2+)] is observed in these solutions. The time-dependent decay of the N(III) intermediates, mainly by their oxidation at the liquid-air interface, serves as a precondition for the study of the etch rate as function of the intermediate concentration measured by Raman spectroscopy. From a linear relationship between etch rate and [N4O6(2+)] concentration, NO+ is considered to be a reactive species in the rate-limiting step. This step is attributed to the oxidation of permanent existing Si-H bonds at the silicon surface by the reactive NO+ species. N2O3 serves as a reservoir for the generation of NO+ leading to a complete coverage of the silicon surface with reactive species at high intermediate concentrations. As long as this condition is valid (plateau region), the etch rate is constant and yields a smooth silicon surface upon completion of the etching. If the N2O3 concentration is insufficient to ensure a coverage of the Si surface by NO+, the etch rate decreases linearly with the N2O3 concentration and results in a roughening of the etched silicon surface (slope region).

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Direct current plating, pulse plating, two-pulse plating, and reverse pulse plating were used to produce electrodeposited Co-Cu alloys and Co-Cu/Cu multilayers under galvanostatic control from an electrolyte containing CoSO 4 and CuSO 4 . Atomic force microscopy, X-ray diffraction, and transmission electron microscopy were used to study the sample structure and morphology. Direct current plating resulted in a Co 95 Cu 5 alloy with nearly equal amounts of face-centered cubic ͑fcc͒ and hexagonal close packed phases, while all pulsed current methods yielded multilayers with fcc structure. Giant magnetoresistance ͑GMR͒ behavior was observed in the multilayers with a maximum magnetoresistance ͑MR͒ ratio of about 9% as measured at 8 kOe. The shape of the MR curves and the magnitude of the GMR were very similar, regardless of the sign of the current between the Co deposition pulses. The results of structural studies also confirmed the formation of a multilayer structure for each pulsed electrodeposition mode. The conclusion was that the spontaneous exchange reaction between Co and Cu 2ϩ is responsible for the formation of a pure Cu layer even under reverse pulse plating conditions. The GMR of the multilayer deposits decreased with increasing bilayer number, due to the deterioration of the microstructure as the deposit grew.

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