In this study, a method for fabrication of high aspect ratio silicon nanopillars is presented. The method combines liquid flame spray production of silica nanoparticle agglomerates with cryogenic deep reactive ion etching. First, the nanoparticle agglomerates, having a diameter of about 100 nm, are deposited on a silicon wafer. Then, during the subsequent cryogenic deep reactive ion etching process, the particle agglomerates act as etch masks and silicon nanopillars are formed. Aspect ratios of up to 20:1 are demonstrated. The masking process is rapid, cheap and has the potential to be scaled up for large areas. Three other structured silicon surfaces were fabricated for comparison. All four surfaces were utilized as desorption/ionization on silicon (DIOS) sample plates. The mass spectrometry results indicate that nanopillar surfaces masked with the liquid flame spray technique are well suited as DIOS sample plates.

An atmospheric pressure chemical ionization (APCI) microchip is presented for combining a gas chromatograph (GC) to a mass spectrometer (MS). The chip includes capillary insertion channel, stopper, vaporizer channel, nozzle and nebulizer gas inlet fabricated on the silicon wafer, and a platinum heater sputtered on a glass wafer. These two wafers are joined by anodic bonding creating a two-dimensional version of an APCI microchip. The sample from GC is directed via heated transfer line capillary to the vaporizer channel of the APCI chip. The etched nozzle forms narrow sample plume, which is ionized by an external corona discharge needle, and the ions are analyzed by a mass spectrometer. The GC-microchip APCI-MS combination provides an efficient method for qualitative and quantitative analysis. The spectra produced by microchip APCI show intensive protonated molecule and some fragmentation products as in classical chemical ionization for structure elucidation. In quantitative analysis the GC-microchip APCI-MS showed good linearity (r(2) = 0.9989) and repeatability (relative standard deviation 4.4%). The limits of detection with signal-to-noise ratio of three were between 0.5 and 2 micromol/L with MS mode using selected ion monitoring and 0.05 micromol/L with MS/MS using multiple reaction monitoring.

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We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips - one quantum chip and one control chip - that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90μs, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.