Recently, Cu(In,Ga)Se 2 (CIGS) solar cells have achieved 21% world-record efficiency, partly due to the introduction of a postdeposition potassium treatment to improve the front interface of CIGS absorber layers. However, as high-efficiency CIGS solar cells essentially require long diffusion lengths, the highly recombinative rear of these devices also deserves attention. In this paper, an Al 2 O 3 rear surface passivation layer with nanosized local point contacts is studied to reduce recombination at the standard Mo/CIGS rear interface. First, passivation layers with well-controlled grids of nanosized point openings are established by use of electron beam lithography. Next, rear-passivated CIGS solar cells with 240-nm-thick absorber layers are fabricated as study devices. These cells show an increase in open-circuit voltage (+57 mV), short-circuit current (+3.8 mA/cm 2 ), and fill factor [9.5% (abs.)], compared with corresponding unpassivated reference cells, mainly due to improvements in rear surface passivation and rear internal reflection. Finally, solar cell capacitance simulator (SCAPS) modeling is used to calculate the effect of reduced back contact recombination on high-efficiency solar cells with standard absorber layer thickness. The modeling shows that up to 50-mV increase in open-circuit voltage is anticipated. Index Terms-Al 2 O 3 , Cu(In,Ga)Se 2 , electron beam lithography, local point contacts, nanosized openings, passivation layer, passivated emitter and rear cell (PERC), rear internal reflection, rear surface recombination velocity, Si.
I. INTRODUCTIONO VER the past two years, CIGS solar cells have taken a sudden leap in world record efficiency of 1%, from around 20% to 21% [1]. Before 2013, CIGS solar cell efficiency improvements were mainly due to enhancements in absorber material quality, and cell efficiencies were lingering around 20% for a few years-as achieved by National Renewable Energy Laboratory (NREL) and the Centre for Solar Energy and Hydrogen Research Baden-Württemberg (ZSW) [2]. However, in Manuscript