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Wafer cleaning is one of the most critical processes in the semiconductor device manufacturing. Poly(vinyl alcohol) (PVA) brush scrubber cleaning is much attractive when compared with traditional wet-batch cleaning which causes the cross-contamination among the wafers in a bath and environmental issues with huge amount of chemical and deionized water (DIW) usages. The mechanical forces generated from PVA brush contact can remove the particles on a wafer surface under low concentration of chemical solution without cross-contamination. In this research, we monitored the change of the dynamic forces including normal and friction force generated by PVA brush contacts during cleaning process, and also investigated the effects of scrubbing conditions of PVA brush overlap and velocity, and the surface tension (low- or high-hydrophilic) of the wafer on the particle removal efficiency. The results show that the driving mechanism to remove the particle on a wafer surface can be changed by the PVA brush overlap and velocity condition such as the hydrodynamic drag force in the brush soft contact condition and friction force in the brush hard contact condition. The particle removal efficiency is higher under the low-hydrophilic surface having a low surface tension compared to high-hydrophilic surface.
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