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Research on the improvement of efficiency in the manufacturing industry is underdeveloped partly because of the ambiguous objectives of the technical development of efficiencies in terms of energy consumption reduction. Consequently, the technical development of high-efficiency techniques that consider the whole manufacturing system is rarely addressed in industrial research. For this reason, this report aims to find the patterns in, and the definitions of, the technologies that will lead to efficiency improvement in the entire manufacturing industry by thoroughly investigating the literature about energy consumption reduction strategies, energy policies, and the state-of-the-art for energy-saving methods that are being pursued currently in several major countries. Through this study, the necessity and importance of the foregoing three items have been identified, and a way of defining the productivities of an energy-saving manufacturing system distinct from those of conventional manufacturing systems was attempted. It is also shown that the development of energy-saving and energy-harvesting technologies for all industrial sectors has emerged as a herald of economic growth in the near future.

The effects of thermal cycling on critical adhesion energy and residual stress at the interface between benzocyclobutene ͑BCB͒ and silicon dioxide ͑SiO 2 ͒ coated silicon wafers were evaluated by four-point bending and wafer curvature techniques. Wafers were bonded using BCB in an established ͑baseline͒ process, and the SiO 2 films were deposited by plasma-enhanced chemical vapor deposition ͑PECVD͒. Thermal cycling was done between room temperature and a peak temperature. In thermal cycling performed with 350 and 400°C peak temperatures, the critical adhesion energy increased significantly during the first thermal cycle. The increase in critical adhesion energy is attributed to relaxation of residual stress in PECVD SiO 2 , which in turn is attributed to condensation reactions in those films. Thermal cycling also cures the BCB beyond the ϳ88% achieved in the baseline process, and the residual stress in the BCB is reset at a glass transition temperature corresponding to the increased BCB cure conversion. As more thermal cycles are performed, stress hysteresis in the BCB decreases as the cure stabilizes at 94-95%.

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