This paper provides an industry perspective on atomic layer etching (ALEt) process. Two process sequences representing two different methods of ALEt are described, followed by several examples where ALEt can be an enabling process technology in the semiconductor industry. The authors believe that there needs to be an increased understanding of surface functionalization, modification and chemistry-based material removal. We are confident that this review article will allow for increased scientific and technological solutions for enabling ALEt.

Bundles of single wall carbon nanotubes have been proposed as an interconnect that could potentially replace copper in state-of-the-art ultralarge-scale-integrated circuits if theoretically predicted inductance, resistance, and capacitance scale with the number of carbon nanotubes within the bundle. The authors report direct measurement of the kinetic inductance of individual single wall carbon nanotubes and measurement of the high-frequency impedance of bundles showing that the bundle inductance scales with the number of individual carbon nanotubes.

Articles you may be interested inClassical size effect in oxide-encapsulated Cu thin films: Impact of grain boundaries versus surfaces on resistivity J. Vac. Sci. Technol. A 26, 605 (2008); 10.1116/1.2938395Electrical resistivity of Cu films deposited by ion beam deposition: Effects of grain size, impurities, and morphological defect

We directly compared ensemble spectroscopic measurements to a statistically rigorous single molecule electrical characterization of individual SWNT devices using a high throughput electrical probe station and reported, for the first time, a highly accurate extinction coefficient ratio for metallic to semiconducting SWNTs of 0.352 +/- 0.009. The systematic counting of metallic and semiconducting types from solution also allows us to examine the variances associated with device properties and therefore provide the first measure of potential defect generation during processing methods.