High-rate deposition of biaxially textured yttria-stabilized zirconia by dual magnetron oblique sputtering Abstract: Highrate sputter deposition-circular magnetrons J. Vac. Sci. Technol. 15, 178 (1978); 10.1116/1.569449
Selfsputtering phenomena in highrate coaxial cylindrical magnetron sputteringThis article reports on the process of high-rate magnetron sputtering of solid materials using an unbalanced magnetron with extremely high target power densities of up to 150 W cm Ϫ2 . Particular attention is devoted to a comparison of sputtering in the 10 Ϫ1 Pa range, low pressure sputtering ͑Ͻ10 Ϫ1 Pa͒, and self-sputtering. The advantages and drawbacks of the sputtering process at different pressures are critically analyzed. The extinction pressure measured as a function of the magnetron discharge current for the magnetron discharge of Cu, Ag, and Ti targets is given. Deposition rates and selected properties of Ti and Cu films are also reported.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.