High-rate deposition of biaxially textured yttria-stabilized zirconia by dual magnetron oblique sputtering Abstract: Highrate sputter deposition-circular magnetrons J. Vac. Sci. Technol. 15, 178 (1978); 10.1116/1.569449
Selfsputtering phenomena in highrate coaxial cylindrical magnetron sputteringThis article reports on the process of high-rate magnetron sputtering of solid materials using an unbalanced magnetron with extremely high target power densities of up to 150 W cm Ϫ2 . Particular attention is devoted to a comparison of sputtering in the 10 Ϫ1 Pa range, low pressure sputtering ͑Ͻ10 Ϫ1 Pa͒, and self-sputtering. The advantages and drawbacks of the sputtering process at different pressures are critically analyzed. The extinction pressure measured as a function of the magnetron discharge current for the magnetron discharge of Cu, Ag, and Ti targets is given. Deposition rates and selected properties of Ti and Cu films are also reported.
This article reports on the sputtering of pure Ti and Ti-based alloy films onto substrates where the temperature Ts was kept below 100 °C, using the magnetron sputter ion plating process. It was found that while the pure Ti film is a hexagonal low-temperature phase film (h–αTi), the Ti–Cr, and Ti–Fe alloy films, containing a relatively small amount of Cr or Fe of about 10 wt %, are cubic high-temperature beta phase Ti alloy films [c-βTi(Cr) or c-βTi(Fe)]. This finding is of immense importance both scientifically and practically. The conditions under which high-temperature phases are formed in alloy films sputtered at substrate temperatures below 100 °C, which is much lower than the temperature necessary to form these high-temperature phases (Thtp) according to the equilibrium phase diagram, will be discussed in detail. X-ray diffraction analyses of these films will also be presented.
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