1996
DOI: 10.1116/1.580045
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High-rate magnetron sputtering

Abstract: High-rate deposition of biaxially textured yttria-stabilized zirconia by dual magnetron oblique sputtering Abstract: Highrate sputter deposition-circular magnetrons J. Vac. Sci. Technol. 15, 178 (1978); 10.1116/1.569449 Selfsputtering phenomena in highrate coaxial cylindrical magnetron sputteringThis article reports on the process of high-rate magnetron sputtering of solid materials using an unbalanced magnetron with extremely high target power densities of up to 150 W cm Ϫ2 . Particular attention is devoted t… Show more

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Cited by 49 publications
(15 citation statements)
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“…This is due to the coating hardness of about 25 GPa [2], which exceeds the bulk material hardness by many times. Necessary for synthesis of titanium nitride and other hard coatings metal vapor is produced by means of vacuum arc evaporation [3] and magnetron sputtering [4]. To prevent from droplets in the coatings the vacuum arc plasma can be filtered [5].…”
Section: Introductionmentioning
confidence: 99%
“…This is due to the coating hardness of about 25 GPa [2], which exceeds the bulk material hardness by many times. Necessary for synthesis of titanium nitride and other hard coatings metal vapor is produced by means of vacuum arc evaporation [3] and magnetron sputtering [4]. To prevent from droplets in the coatings the vacuum arc plasma can be filtered [5].…”
Section: Introductionmentioning
confidence: 99%
“…In addition to the vacuum arc, magnetron sputtering systems [13][14][15][16][17] and hollow cathode sputtering systems [18][19][20][21][22] can be also used for the coating deposition. In all cases, the coating is bombarded during the synthesis by ions accelerated from the gas discharge plasma [23][24][25][26] or using broad beam sources of ions or fast gas atoms [27][28][29].…”
Section: Introductionmentioning
confidence: 99%
“…Another method widely used for the production of titanium vapor is magnetron sputtering [8], which excludes the metal droplets. However, the magnetron sputtering is characterized by a low efficiency of the target material use, a low ionization degree of sputtered atoms and a low plasma density near the product surface.…”
Section: Introductionmentioning
confidence: 99%