Since thermal aging embrittlement (TE) causes loss of fracture toughness and may lead to failure, it is one of structural integrity issues to be assessed in nuclear industry. In this study, crack growth simulation by using extended finite element method (XFEM) was carried out for CF8M base metal and ER316L weld metal, which are typical vulnerable materials. First, user subroutines were constructed to incorporate variation of mechanical properties of two materials due to the TE. In particular, with regard to ER316L, weld residual stress (WRS) distribution was considered. Second, validity of the subroutines and XFEM was confirmed by comparing with analytical and experimental data. Finally, crack growth analyses for nuclear pipes were performed by applying the verified methodology. Thereby, differences of the crack growth amounts and paths as the presence or absence of the TE and WRS were quantified and discussed.
In this paper, we investigated the cell-to-cell interference in scaled-down 3D NAND flash memory by using a Technology Computer-Aided Design (TCAD) simulation. The fundamental cause of cell-to-cell interference is that the electric field crowding point is changed by the programmed adjacent cell so that the electric field is not sufficiently directed to the channel surface. Therefore, the channel concentration of the selected cell is changed, leading to a Vth shift. Furthermore, this phenomenon occurs more severely when the selected cell is in an erased state rather than in a programmed state. In addition, it was confirmed that the cell-to-cell interference by the programmed WLn+1 is more severe than that of WLn−1 due to the degradation of the effective mobility effect. To solve this fundamental problem, a new read scheme is proposed. Through TCAD simulation, the cell-to-cell interference was alleviated with a bias having a ΔV of 1.5 V from Vread through an optimization process to have appropriate bias conditions in three ways that are suitable for each pattern. As a result, this scheme narrowed the Vth shift of 67.5% for erased cells and narrowed the Vth shift of 70% for programmed cells. The proposed scheme is one way to solve the cell-to-cell interference that may occur as the cell-to-cell distance decreases for a high stacked 3D NAND structure.
The purpose of this study was to analyze for resonant frequency, vibration transmissibility and damping ratio of multi-layered corrugated structures using a random vibration test. Methods: The random vibration test was performed by the ASTM D4728 specifications using two paperboards (S120, K180) and two types of flutes (A/F, B/F). Damping ratio of the multi-layered corrugated structures was estimated using a theoretical equation derived from the measured resonant frequency and transmissibility. Results: The resonant frequency and vibration transmissibility of the multi-layered corrugated structures of K180 and B-flute were higher than those of S120 and A-flute, respectively; however, the damping ratio of each sample had the opposite tendency. The resonant frequency was inversely proportional to the sample thickness and static stress; vibration transmissibility and damping ratio were not correlated with sample thickness and static stress. In addition, we developed a mathematical model of the resonant frequency with variables of sample thickness and static stress. Conclusions: Results of this study can be useful for environment-friendly and optimal packaging design since vibration has been a key factor in cushioning packaging design.
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