By studying the minority carrier lifetime in recently manufactured commercially available n‐ and p‐type float‐zone (FZ) silicon from five leading suppliers, we observe a very large reduction in the bulk lifetime when FZ silicon is heat‐treated in the range 450–700 °C. Photoluminescence imaging of these samples at the wafer scale revealed concentric circular patterns, with higher recombination occurring in the centre, and far less around the periphery. Deep level transient spectroscopy measurements indicate the presence of recombination active defects, including a dominant center with an energy level at ∼Ev + 0.5 eV. Upon annealing FZ silicon at temperatures >1000 °C in oxygen, the lifetime is completely recovered, whereby the defects vanish and do not reappear upon subsequent annealing at 500 °C. We conclude that the heat‐treatments at >1000 °C result in total annihilation of the recombination active defects. Without such high temperature treatments, the minority carrier lifetime in FZ silicon is unstable and will affect the development of high efficiency (>24%) solar cells and surface passivation studies.

(2016) Permanent annihilation of thermally activated defects which limit the lifetime of float-zone silicon. Physica Status Solidi A . Permanent WRAP URL:

Float zone silicon (FZ-Si) is typically assumed to be an extremely high quality material, with high minority carrier lifetimes and low concentrations of recombination active defects. However, minority carrier lifetime in FZ-Si has previously been shown to be unstable following thermal treatments between 450 and 700 °C, with a range of unidentified deep level states being linked to reduced carrier lifetime. There are suspicions that nitrogen doping, which occurs from the growth atmosphere, and intrinsic point defects play a role in the degradation. This study aims to address this by using deep level transient spectroscopy (DLTS), minority carrier transient spectroscopy, Laplace DLTS, and photoluminescence lifetime measurements to study recombination active defects in nitrogen-doped and nitrogen-lean n-type FZ-Si samples. We find that nitrogen-doped samples experience increased degradation due to higher concentrations of deep level defects during thermal treatments compared to nitrogen-lean samples. In an attempt to explain this difference, in-diffusion of nickel has been used as a marker to demonstrate the existence of higher vacancy concentrations in the nitrogen-doped samples. The origin of the recombination active defects responsible for the thermally induced lifetime degradation in FZ-Si crystals is discussed.

Results on the diffusion of Cl into CdTe are described. Diffusion anneals were carried out at selected temperatures in the range between 200 degrees C and 700 degrees C in evacuated SiO2 ampoules using a diffusion source of CdCl2 under saturated vapour pressure conditions. The concentration profiles were measured using a radiotracer sectioning technique. The profiles were found to be composed of four parts, to which a computer package consisting of the sum of four complementary error functions (erfc) gave satisfactory fits to the data. The fastest-diffusing component gave values of the diffusivity that agreed with previously published results. Proposals explaining how this type of diffusion may occur are given.

Float-zone silicon has been long assumed to be bulk defect free and stable. Nevertheless, recently it was found that upon annealing between 450 °C to 700 °C detrimental defects can be activated in this material. Previous studies via deep level transient spectroscopy have identified several defect levels. However, it is still not clear which of these levels have a substantial impact on the minority carrier lifetime. In this study, we determine the recombination parameters of the dominant defect level using a combination of deep level transient spectroscopy and temperature and injection dependent lifetime spectroscopy. Additionally, we investigated the effect of hydrogenation on the thermally activated defects in ntype float-zone silicon.