We report on 269 nm emission deep ultraviolet light-emitting diodes (LEDs) over sapphire. The material quality, device design, and contact processing sequence yielded devices with external quantum efficiencies as high as 0.4% for a pumped pulse current of 200 mA and 0.32% for a dc pump current of 10 mA. For a module of two LEDs connected in series, a record continuous-wave power of 0.85 mW (at 40 mA) and a wall plug efficiency of 0.16% (at 10 mA dc) were measured.

We present a detailed high-pump-current study of self-heating effects in ultraviolet light-emitting diodes (LEDs) grown on sapphire. For deep ultraviolet LEDs on sapphire, our results establish self-heating to be a primary cause of premature power saturation under dc pumping. Even the flip-chip packaged devices undergo a steady-state temperature rise to about 70 °C at a dc pump current of only 50 mA (at 8 V) resulting in a significant decrease in LED output. Temperature rise values estimated from peak emission wavelength shifts and from micro-Raman mapping of the active devices were in good agreement.

We report homoepitaxial GaN growth on freestanding (11̄00) oriented (M-plane GaN) substrates using low-pressure metalorganic chemical vapor deposition. Scanning electron microscopy, atomic-force microscopy, and photoluminescence were used to study the influence of growth conditions such as the V/III molar ratio and temperature on the surface morphology and optical properties of the epilayers. Optimized growth conditions led to high quality (11̄00) oriented GaN epilayers with a smooth surface morphology and strong band-edge emission. These layers also exhibited strong room temperature stimulated emission under high intensity pulsed optical pumping. Since for III-N materials the (11̄00) crystal orientation is free from piezoelectric or spontaneous polarization electric fields, our work forms the basis for developing high performance III-N optoelectronic devices.

An ultraviolet light-emitting diode with peak emission wavelength at 340 nm is reported. The active layers of the device were comprised of quaternary AlInGaN/AlInGaN multiple quantum wells, which were deposited over sapphire substrates using a pulsed atomic-layer epitaxy process that allows precise control of the composition and thickness. A comparative study of devices over sapphire and SiC substrates was done to determine the influence of the epilayer design on the performance parameters and the role of substrate absorption.

We report the detailed structure analysis of our AlN∕AlGaN superlattice (SL) grown by pulsed atomic-layer epitaxy (PALE) for dislocation filtering. Due to the nature of PALE, the AlGaN well material itself in the SL was found to be composed actually of an AlxGa1−xN∕AlyGa1−yN short-period superlattice (SPSL), with the periodicity of 15.5Å (≈6 monolayer), determined consistently from high-resolution x-ray diffraction and high-resolution transmission electron microscopy measurements. The SPSL nature of the AlGaN layers is believed to benefit from the AlN∕AlGaN SL’s coherent growth, which is important in exerting compressive strain for the thick upper n-AlGaN film, which serves to eliminate cracks. Direct evidence is presented which indicates that this SL can dramatically reduce the screw-type threading dislocation density.

We report on AlGaN single-quantum-well light-emitting diodes (LEDs) on sapphire with peak emission at 285 nm. A study is presented to identify the key material parameters controlling the device quantum efficiency. At room temperature, for a 200 μm×200 μm square geometry mesa type device, we obtain a power as high as 0.25 mW for 650 mA pulsed pumping. The LEDs show significantly higher output powers at temperatures below 100 K.

In this paper, we report the pulsed atomic-layer epitaxy (PALE) of ultrahighquality AlN epilayers over basal-plane sapphire substrates and their use as templates to grow high-quality AlGaN layers with Al content ranging from 0.3 to 1. Symmetric/asymmetric x-ray diffraction (XRD) and room-temperature (RT) photoluminescence (PL) measurements were used to establish the highstructural and optical quality. The XRD (002) and (114) rocking-curve fullwidth at half-maximum (FWHM) values of the PALE-grown AlN epilayers were less than 60 arcsec and 250 arcsec, respectively. Using these ultrahighquality layers as templates, Si-doped AlGaN layers with a large Al content from 30% to 100% were grown and used for milliwatt power sub-280-nm, deepultraviolet (UV) light-emitting diodes (LEDs).

We have measured the field electron emission (FE) from a surface covered with two ultrathin layers of semiconductor, 4 nm GaN on 2 nm Al0.5Ga0.5N. The threshold field was 50 V/μm, with stable FE current densities up to 3×10−2 A/cm2. We have also measured the FE dependence with field and temperature and determine then an effective surface tunneling barrier ⩽0.5 eV, coexisting with an effective thermal activation energy of ∼0.85 eV. To interpret these experimental results, we propose a dual-barrier model, related to the nanostructured layers, with a serial two-step mechanism for the electron emission, taking into account the space charge formation in the quantum well structure at the surface.