A visible-blind UV camera based on a 32 x 32 array of backside-illuminated GaN/AlGaN p-i-n photodiodes has been successfully demonstrated. Each of the 1024 photodiodes in the array consists of a base n-type layer of AlGaN (~20%) onto which an undoped GaN layer followed by a p-type GaN layer is deposited by metallorganic vapor phase epitaxy. Double-side polished sapphire wafers are used as transparent substrates. Standard photolithographic, etching, and metallization procedures were employed to obtain fully-processed devices. The photodiode array was hybridized to a silicon readout integrated circuit using In bump bonds. Output from the UV camera was recorded at room temperature at a frame rate of 30 Hz. This new type of visible-blind digital camera is sensitive to radiation from 320 nm to 365 nm in the UV spectral region.
Visible-blind UV cameras based on a 32 × 32 array of backside-illuminated GaN/AlGaN p-i-n photodiodes have been successfully demonstrated. The photodiode arrays were hybridized to silicon readout integrated circuits (ROICs) using In bump bonds. Output from the UV cameras were recorded at room temperature at frame rates of 30−240 Hz. These new visible-blind digital cameras are sensitive to radiation from 285−365 nm in the UV spectral region.
A concept based on structures fabricated using stacked semiconducting layers to obtain a multi spectral photoresponse is investigated. Issues related to III nitride layer growth on thin Si wafers, such as substrate temperature recalibration and mechanical stress due to the lattice mismatch, have been studied. The grown on Si substrate III nitride layers were characterized by using spectroscopic ellipsometry and capacitance measurements. Fabrication of a dual-band UV/IR photodetector with a reasonable responsivity at room temperature has been demonstrated. The integrated device is capable of detecting optical emissions separately in the UV and IR parts of the spectrum. The responsivities of this device are ∼0.01 A/W, at a peak wavelength of 300 nm and ∼0.08 A/W, at a peak wavelength of 1000 nm, respectively. The described dual-band photodetectors can be employed for false alarm-free fire/flame detection and advanced hazardous object or target detection and recognition in several industrial, military, and space applications.
An ultraviolet-specific (320-365 nm) digital camera based on a 128×128 array of backside-illuminated GaN/AlGaN p-i-n photodiodes has been successfully developed. The diode structure consists of a base n-type layer of AlGaN (~23% Al) followed by undoped and then p-type GaN layers deposited by metal organic vapor phase epitaxy. Double-side polished sapphire wafers serve as transparent substrates. Standard photolithographic, etching, and metallization procedures were employed to fabricate the devices. The fully-processed photodiode array was hybridized to a silicon readout integrated circuit (ROIC) using In bump bonds for electrical contact. The UV camera was operated at room temperature at frame rates ranging from 15 to 240 Hz. A variety of UV scenes were successfully recorded with this configuration.
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