GaN detector arrays are hybridized to a Si readout integrated circuit (ROIC) using flip-chip bonding techniques. GaN is transparent for visible light. Then, visible light will be absorbed by the Si ROIC. It can affect the performance of the ROIC. In this paper, we discuss the mechanism of these effects: under visible light illumination, during the integration period, the photocurrents generated by the PMOS reset switch and NMOS test switch are accumulated by the integration capacitor, while during the readout period, the photocurrent generated by the PMOS sampling switch is accumulated by the sample/hold capacitor. These effects can be reduced by covering an extra aluminium layer on the top of the readout circuit, which is proved to be effective by experiment.