In this study, we proposed a novel technology for developing a nanoscale, high-resolution, and cost-efficient next-generation semiconductor process that uses exposure technology with ultraviolet-light-emitting diode (UV-LED) arrays and poly(dimethylsiloxane) (PDMS) flexible soft mold imprint technology in order to develop a vacuum-assisted photoresist filling technology for microstructures. By integrating the characteristics of the PDMS soft mold, photocure resist, and vacuum-assisted filling system to fabricate waveguide components, conformal contact was obtained between a PDMS soft mold and a substrate surface, at a low surface free energy. The vacuum-assisted filling system was used to achieve compact and complete photoresist filling. There is no residual layer left after filling and a subsequent process is no longer necessary; thus, cost and process time can be effectively reduced. Recently, nanometer component manufacturing technology and its applications have become more sophisticated.
In this study, we develop a vacuum-assisted photo resist filling technology for micro-structures by integrating the characteristics of PDMS soft mold, photo cure resist, and vacuum equipment. Together with soft mold, this technology can be adopted in the production of optical waveguide components. Conformal contact can be achieved on the material surface with PDMS soft mold. Meanwhile, it has a low surface free energy and won't stick to the resist during the filling. By vacuum pumping, the resist filling will be compact and complete. It increases the effective filling area significantly.
In this study, we integrate the electromagnetic soft mold imprint technique with the electrophoretic deposition technique, and apply them to forming microelectrode structures. The compound casting technology is used to produce a magnetic soft mold of a microelectrode structure, which can effectively reduce the time and cost of molding. The use of an electromagnetic imprint device can apply more evenly distributed imprint pressure, thus, the microelectrode structure can be entirely imprinted onto an indium tin oxide (ITO) soft substrate, and then the electrophoretic deposition technique is employed to deposit titanium dioxide (TiO2) nanopowder on the ITO soft substrate of the microelectrode structure. In addition to the key techniques and processes of electromagnetic soft mold imprinting, In this study, we explore the application of electrophoretic deposition and imprinting to prove that combining these techniques to form a microelectrode structure is a simple, low-cost, high duplication, and high-speed process. It is proven a good choice for producing micro-nanocomponents.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.