A single-walled carbon nanotube (SWNT) is a wrapped single graphene layer, and its plastic deformation should require active topological defects--non-hexagonal carbon rings that can migrate along the nanotube wall. Although in situ transmission electron microscopy (TEM) has been used to examine the deformation of SWNTs, these studies deal only with diameter changes and no atomistic mechanism has been elucidated experimentally. Theory predicts that some topological defects can form through the Stone-Wales transformation in SWNTs under tension at 2,000 K, and could act as a dislocation core. We demonstrate here, by means of high-resolution (HR)-TEM with atomic sensitivity, the first direct imaging of pentagon-heptagon pair defects found in an SWNT that was heated at 2,273 K. Moreover, our in situ HR-TEM observation reveals an accumulation of topological defects near the kink of a deformed nanotube. This result suggests that dislocation motions or active topological defects are indeed responsible for the plastic deformation of SWNTs.

A multi-layered MoS 2 film was formed on a SiO 2 film by high-temperature sputtering, which is one of the alternative methods of Si LSI technology. It was found that the carrier density of a sputter-deposited MoS 2 film is 1000 times smaller than that of an exfoliated one. By sputtering, two different orientations, namely a layer lateral to a SiO 2 /Si substrate and a layer perpendicular to the substrate, were formed. The lateral layer showed a lower carrier density than the perpendicular layer because of the decrease in the number of sulfur vacancies, as commonly discussed in several research studies. However, the vacancies are not sufficient for describing this significant reduction in carrier density. It is considered that a sodium ion functioning as an interface trapped charge is one of the main origins of carriers. Sputtering, which enables us to determine the sodium contamination level, can be seen as appropriate for reducing the carrier density; hence, this method is considered to be efficient in realizing enhancement-mode MoS 2 MOSFETs. In addition, sputtering also enable us to form large-scale MoS 2 films up to a wafer size. Therefore, a sputterdeposited MoS 2 film is a promising material for post-silicon devices.

The atomic scale characterization of dopant atoms in semiconductor devices to establish correlations with the electrical activation of these atoms is essential to the advancement of contemporary semiconductor process technology. Spectro-photoelectron holography combined with first-principles simulations can determine the local three-dimensional atomic structures of dopant elements, which in turn affect their electronic states. In the work reported herein, this technique was used to examine arsenic (As) atoms doped into a silicon (Si) crystal. As 3d core level photoelectron spectroscopy demonstrated the presence of three types of As atoms at a total concentration of approximately 10 cm, denoted as BEH, BEM, and BEL. On the basis of Hall effect measurements, the BEH atoms corresponded to electrically active As occupying substitutional sites and exhibiting larger thermal fluctuations than the Si atoms, while the BEM atoms corresponded to electrically inactive As embedded in the AsV (n = 2-4) type clusters. Finally, the BEL atoms were assigned to electrically inactive As in locally disordered structures.

Crystallographic characterization and the ferroelectric properties of 50 nm-thick sputter-deposited Al0.78Sc0.22N films deposited at room temperature (RT) and 400 °C are investigated. c-axis oriented growths were confirmed by x-ray diffraction patterns with rocking curve measurements for both samples. Al0.78Sc0.22N films were found to grow in the c-axis direction and showed poling-free ferroelectric properties, which are advantageous for practical memory and piezoelectric applications. Although the metal-ferroelectric-metal (MFM) capacitors represent low switching cycle endurance, MFM capacitors revealed remnant polarization (Pr) of 70 μC/cm2 and 113 μC/cm2 for RT- and 400 °C-deposited samples, respectively. Ferroelectric films with low-temperature process capability can open a wide range of applications.

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