This study considers the risk management of insurance policies in line with the implementation of the new International Financial Reporting Standards 17. It applies the paid-incurred chain method to model the future unpaid losses by combining the information channels of both the incurred claims and paid losses. We propose the recovery of the empirical distribution of the outstanding claims liabilities associated with a group of contracts via moment-based density approximation. We determine the risk measures and adjustments that are compliant with the new standard using the Monte–Carlo simulation method and approximated distributions. The historical data on the aggregate Ontario automobile insurance claims over a 15-year period are analyzed to examine the appropriateness and accuracy of our approach.
Silicon/glass anodic bonding is widely investigated during MEMS packaging of multi-stack structures. The electrical behavior of anode bonding can be described as the charging and discharging process of RC circuit. Here, we conduct the equivalent RC circuit model analysis and experimental investigation, and demonstrate that voltage division and electricity leakage are the dilemma for the conventional multi-stack anodic bonding. By using feedthrough, the feasibility and convenience of “shorting out bonding” is presented, which is exampled through the wafer-level packaging of the MEMS gyroscope. Result from the sensor’s vacuum characterization reveals that shorting out bonding for multi-stack silicon/glass structures is an effective method for wafer-level packaging due to long-term stability and low temperature property.‘
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