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The existing CAD formulae for dielectric loss of microstrip lines on substrate are complicated and inaccurate at high frequencies. In particular, no closed-form expression has been obtained for the dielectric loss of microstrip lines on multi-layer dielectric substrate by including the conductor-substrate interphase effect, although attempts have been made to study the finite thickness effect of the conductor and dielectric substrate. The present work represents the first attempt to obtain a closed-form CAD formula for the dielectric loss of microstrip lines on dielectric substrates by considering the effect of conductor-substrate interphase. Our simple and accurate model systematically considers the effect of the interphase between the microstrip line and substrate by using a quasi-TEM approach and is shown to be supported by the available experimental data.

High dielectric constant (high-k) materials are needed for embedded passives in advanced packaging applications. This work presents a systematic theoretical investigation of the effective dielectric constant, dielectric loss of dielectric polymers filled with high-k coated conducting particles with the objective to aid the design of polymer/filler composite materials with high dielectric constant and low dielectric loss at high frequencies. Our results demonstrate that, contrary to prevailing views, the filler concentration and coating layer thickness dependences of the effective dielectric constant and loss are non-monotonic. Implications for high-k materials design are also outlined.