Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.
DOI: 10.1109/isapm.2005.1432081
|View full text |Cite
|
Sign up to set email alerts
|

Dielectric polymers embedded with high-k coated conducting particles: effective dielectric properties modeling

Abstract: High dielectric constant (high-k) materials are needed for embedded passives in advanced packaging applications. This work presents a systematic theoretical investigation of the effective dielectric constant, dielectric loss of dielectric polymers filled with high-k coated conducting particles with the objective to aid the design of polymer/filler composite materials with high dielectric constant and low dielectric loss at high frequencies. Our results demonstrate that, contrary to prevailing views, the filler… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...

Relationship

0
0

Authors

Journals

citations
Cited by 0 publications
references
References 9 publications
0
0
0
Order By: Relevance

No citations

Set email alert for when this publication receives citations?