New effective dielectric constant model for ultra-high speed microstrip lines on multilayer dielectric substrates: effect of conductor-dielectric interphase

Vo, H.T.; Davidson, Cameron; Shi, Frank G.

doi:10.1109/ectc.2002.1008077

Cited by 8 publications

(4 citation statements)

References 9 publications

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“…The glass substrate has a dielectric constant of ε sub . The effective dielectric constant ɛ eq of the stacked substrate structure of PET:glass:PET can be computed using (2) [7]

ε^{eq} = \frac{false(1 / u false)}{()(, 2 / u_{int} / ε_{int}) + ()(, false(1 / u false) - false(2 / u_{int} false) / ε_{sub})}

where u int = w / h int and u = w / h.…”

Section: Geometry Of and Ps Designmentioning

confidence: 99%

Transparent 0° phase shifter using micro‐metal mesh conductive film

2015

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The design of a novel transparent 0°phase shifter (PS) using a proprietary self-assembling nano-particle technology-based micro-metal mesh (MM) conductive film is presented. The transparent MM conductive film has a sheet resistance of 0.7 Ω/sq and a visible-light transmission of 75%, resulting in high transparency and good conductivity. The proposed transparent PS is placed on a 2 mm-thick glass substrate of dielectric 5.7 and designed to operate at 2.45 GHz. A layer of MM film placed at the back of the glass serves as a ground. The transparent PS delivered a measured phase shift of 2.5°. The transparent PS can be used as a building block for realising a transparent Butler matrix (BM) beam forming network for inter/intra-vehicle wireless communication in the intelligent transport system. Besides being transparent, the proposed PS has a 0.25 mm profile excluding the glass substrate. These advantages greatly enhance the PS's potential to be used also as a BM building component that can be mounted onto the glass surfaces of buildings for future fifth generation (5G) indoor wireless communications.

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“…The glass substrate has a dielectric constant of ε sub . The effective dielectric constant ɛ eq of the stacked substrate structure of PET:glass:PET can be computed using (2) [7]

ε^{eq} = \frac{false(1 / u false)}{()(, 2 / u_{int} / ε_{int}) + ()(, false(1 / u false) - false(2 / u_{int} false) / ε_{sub})}

where u int = w / h int and u = w / h.…”

Section: Geometry Of and Ps Designmentioning

confidence: 99%

Transparent 0° phase shifter using micro‐metal mesh conductive film

2015

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“…Layer of air between a suspended substrate and reference conductor shield introduces layered medium effect (Awasthi et al 2005). Very thin layers like bonding materials for adhering conductors to a PCB substrate also create multilayer structure, effect of which has to be taken into account for higher frequencies (Vo et al 2002). Multilayer transmission structures widely used in ICs like thin film-microstrip line (TFMSL), metal-insulator-metal-insulator (MIMI) structures or inverted embedded microstrips (IEM) are also cases of stratified medium (Zhang & Song 2007).…”

Section: Microwave Devices In Stratified Dielectric Mediummentioning

confidence: 99%

Modelling of Stratified Dielectric Medium Stripline Delay Devices

Mikučionis¹

2014

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“…With this trend of increase in the digital system speed, a number of frequency-dependant behaviors start to impact signal propagation in typical digital system. Examples of those behaviors are; skin effect (frequency dependant losses) [1] and [3]-[5] and frequency dependant dielectric constant [6]. Analyzing the impact of those frequency-dependant parameters on SI can be done using the same traditional TD based tools and methodology [2], but this approach involves a non-straight-forward correlation between…”

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confidence: 99%

A new frequency domain based methodology for signal integrity analysis

El-Rouby¹

2010

The 2010 International Conference on Computer Engineering &Amp; Systems

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The co-existence of two different sets of parameter definitions, requirements and specifications in the domain of digital system design; namely the time domain (TD) and frequency domain (FD), is imposing some challenges on digital system design. Those challenges are increasing with the increase in system speed and are hard to address using traditional methods. This paper proposes a new methodology to perform signal integrity (SI) analysis, fully, in frequency domain to help addressing those challenges. To perform SI analysis, fully, in FD it is required to build the correct system model, construct an efficient methodology and develop quantitative measures and relationships as well as correlation to TD quantities. The focus in this paper will be on the first two items where a system model and an efficient FD methodology are introduced and their accuracy, compared to TD simulations, is examined. Keywords-digital system design, frequency domain, signal integrity, time-domain frequency-domain correlation. I INTRODUCTIONIn the digital system domain, there are two different sets of parameters to define electrical specifications of system components as well as parameters and requirements, namely time domain (TD) and frequency domain (FD). TD parameters, such as rise time, fall time, slew rate, over and under shoot, ring back, etc. are more suitable to define the specifications of active components such as input/output (IO) driver and receiver buffers, therefore TD parameters are widely used by silicon manufacturers and designers. On the other hand, FD parameters, such as trace impedance, reflection coefficient, cross talk, etc. are more suitable to describe the spectrum and bandwidth of signals, frequency characteristics of materials and interconnect components. Hence, FD is widely used in describing the characteristics of materials, interconnect components, printed circuit boards (PCBs) and passive components in general.A typical digital electronic system is composed of a driver and a receiver, each usually contained in a package, connected to each other over an interconnect (sockets, PCB traces, vias, cables and connectors) as shown in Figure 1.Typical SI analysis aims at simulating -for developing and/or debugging a digital electronic system-electrical signal waveforms propagating from driver to receiver over the interconnect under; all, worst or statistically selected, cases of possible operating conditions. The common practice is to use a TD transient analysis tool, commercial or self-developed EDA, such as SPICE and ELDO. This common practice is inherited from the era of low speed digital system and implies the cosimulation of the passive and active system elements in the same environment, which represents an area of continuous research [2]. Figure 1: simplified general schematic for a typical digital electronics systemIn general, this co-simulation is performed by developing accurate models for the passive elements in the FD then approximating them with lumped-element equivalent models for the co-simulation, in T...

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New effective dielectric constant model for ultra-high speed microstrip lines on multilayer dielectric substrates: effect of conductor-dielectric interphase

Cited by 8 publications

References 9 publications

Transparent 0° phase shifter using micro‐metal mesh conductive film

Transparent 0° phase shifter using micro‐metal mesh conductive film

Modelling of Stratified Dielectric Medium Stripline Delay Devices

A new frequency domain based methodology for signal integrity analysis

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