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There are many applications throughout the military and commercial industries whose thermal profiles are dominated by intermittent and/or periodic pulsed thermal loads. Typical thermal solutions for transient applications focus on providing sufficient continuous cooling to address the peak thermal loads as if operating under steady-state conditions. Such a conservative approach guarantees satisfying the thermal challenge but can result in significant cooling overdesign, thus increasing the size, weight, and cost of the system. Confluent trends of increasing system complexity, component miniaturization, and increasing power density demands are further exacerbating the divergence of the optimal transient and steady-state solutions. Therefore, there needs to be a fundamental shift in the way thermal and packaging engineers approach design to focus on time domain heat transfer design and solutions. Due to the application-dependent nature of transient thermal solutions, it is essential to use a codesign approach such that the thermal and packaging engineers collaborate during the design phase with application and/or electronics engineers to ensure the solution meets the requirements. This paper will provide an overview of the types of transients to consider—from the transients that occur during switching at the chip surface all the way to the system-level transients which transfer heat to air. The paper will cover numerous ways of managing transient heat including phase change materials (PCMs), heat exchangers, advanced controls, and capacitance-based packaging. Moreover, synergies exist between approaches to include application of PCMs to increase thermal capacitance or active control mechanisms that are adapted and optimized for the time constants and needs of the specific application. It is the intent of this transient thermal management review to describe a wide range of areas in which transient thermal management for electronics is a factor of significance and to illustrate which specific implementations of transient thermal solutions are being explored for each area. The paper focuses on the needs and benefits of fundamentally shifting away from a steady-state thermal design mentality to one focused on transient thermal design through application-specific, codesigned approaches.

The low profile piezoelectric synthetic jet is a promising approach for forced air convection cooling of electronics for high density and portable applications. The synthetic jet considered in this paper, known as a DCJ ( [2]), consists of a pair of piezoelectric discs mounted on a frame and driven with a voltage, which causes the discs to mimic the action of a pair of bellows. This DCJ requires a sinusoidal waveform of 125 − 175 Hz at an amplitude up to 50V , and must operate from a 5V DC source. The mostly capacitive load of the DCJ presents a challenge for typical amplifiers. Furthermore, many applications require quiet operation; hence the jet driving waveform must have very low distortion to prevent audible acoustic noise. This paper describes a bidirectional power driver topology for driving capacitive loads based on a dual flyback topology, along with a low-cost, pure sine reference generator with predistortion to allow a clean output waveform without feedback. The driver achieves low power consumption (≈ 250mW ) with low harmonic content. The use of predistortion and a delta-sigma DAC compensates for the inherent flyback converter nonlinearity and the low resolution DAC typical of low-cost microcontrollers. The paper describes and presents experimental results for a design that accomplishes these objectives in a 30 mm × 30 mm × 4 mm volume.

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