Abstract-The design, integration and realization of system in enhanced package approach towards fully functional system level integration by using a compact Bluetooth USB dongle as the demonstrator is presented here. The integration was done on FR4 substrates, which is totally compatible with today's printed circuit board manufacturing capability. A commercially available Bluetooth integrated chip was chosen as the chipset of our demonstrator, and a package integrated antenna together with an embedded front end completes the system in package integration. The front end developed here is based on an embedded meander line combline filter and an embedded transformer balun. The filter has a 35% area reduction when compared with the classical combline filter and similar performance. The balun has the coils distributed on three layers that minimized the board area needed it and optimizes the performances. The proposed packaged integrated antenna approach is successfully demonstrated here and the new module shows excellent performance when compared with a commercial solution, surpassing the normal Bluetooth class II dongle range which is up to 10 m and increasing the module range up to 120 m without an extra power amplifier.Index Terms-Dielectric resonator antenna (DRA), embedded front end, embedded passives, package integrated antenna, system in package (SiP), wireless module.
We report the development of a low cost, simple optical circuit board (OECB) using large core Multi Mode polymer waveguide on FR4 printed circuit board (PCB). The design of this OECB uses only a 45°-ended waveguide to couple and decouple the optical signal directly between the optical devices and the waveguide. The 45°mirror is formed using excimer laser process on a multi mode waveguide with temperature stability at reflow temperature. The optical waveguide is attached to a diced channel in the FR4 PCB using adhesive to form a completely planar circuit. This allows the laser diode and the photodiode to be assembled directly above the input and output of the waveguide using precision flip chip technology, which provides good alignment accuracy. This helps to increase the mechanical reliability of the circuit and minimize assembly requirements. Most importantly, all the electronic and optoelectronic devices used are commercially available components, the FR4 PCB fabrication process is standard process, the component assembly process is normal reflow process and the method is amenable for manufacturing. In the present publication, we report the details of the design, assembly process, high accuracy optical device attachment, performance characterization and testing results.
data of the order of 10 Gbps as a minimum to make them In this paper, we illustrate the performance evaluation economically viable. methods for optoelectronic circuit boards (OECBs). Here we However, the light coupling requirements and alignment report the details of the evaluation techniques for a tolerance become tighter as the receiver dimensions happen to bidirectional OECB developed to operate at 10 Gbps using a be smaller at such high data rates. The opto-modules are flip flip chip SMT optical transceiver. The evaluation techniques chip devices and will not be assembled using active alignment include DC and high speed optical characterization of methods. In order to achieve the desired system performance, individual component as well as at interconnect level. intermediate evaluation at each possible phase of development Performance evaluation of optical waveguide, optical DC process has to be carried out. Consequently it is necessary to characterization of VCSEL and photo diode, high speed develop systematic performance characterization techniques to optical characterization of transmitter, receiver and optical streamline the different stages of assembly process. link are described here in detail.In this paper we discuss the performance evaluation
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